MTS Process Integration Engineer, APTD

Boise, ID - USA

Monthly Salary: Not Disclosed

Posted on: Yesterday

Vacancies: 1 Vacancy

Job Summary

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

Department Intro:

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D equipment and materials suppliers and manufacturing teams we ensure the efficient development transfer and implementation of new technology nodes maintaining Microns leadership in the industry.

Position Overview:

As a Process Integration Engineer for Advanced Packaging you willown theend-to-endintegrationofnext generationpackage architectures like 2.5D3D stackingHBM memory integration andhybrid bonding.Youllleadnewtechnologydevelopment and technologytransfer designDOEs and analyzeyield and reliability. You will coordinate across device design process equipment test andmanufacturingteams to deliverhighperformancemulti-dietechnology.This position is intended to be part of Microns Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence lead and mentor others.

Responsibilities:

Own package-level process integrationacross2.5D/3D flows(wafer-to-waferchip-to-waferadvanced interconnects) defining specs and process windows that meethigh performancetargets for HPC/AI products.

Develop and integrate semiconductor manufacturing processes; Designoptimize and implement fabrication flows that seamlessly integrate multiple steps (lithography etch deposition diffusion CMP and thin films) into cohesive production processes.

Plan run and analyze targeted experiments tovalidatenew materials process parameters and design rules to improve yield and device performance.Design and execute DOEson bonding underfill moldingstacking andintegrationsteps; ApplySPCtoparametricsand yield detractors and close the loop with corrective actions.

Analyze yield performance and defect data.Utilize big data physical electrical and defect data to root-cause process weaknesses yield issues and tool variances. Employ SPC and advanced analytics.

Lead technology transferfrom TDto TDandHVM. Establishmask rules materialstool readiness baseline qualification andtechnology validationplans.

Hybrid bonding (CuCu dielectric) integration; Set surface prepplanarityandalignmentrequirements qualifyW2W/C2Wflows and track defectivity and reliability.

Thermocompression &microbumpflows; Optimizeunderfill TC bonding windows and pillar/bump geometries forhighI/O assemblies.

HBM and interposer systems; Co-optimizeTSV/interconnectrouting and thermal paths to meet bandwidth/latency targets. Align package floorplans withchipletpartitioning.

Warpage engineering; Predict and mitigate wafer/diewarpage via modelingcure shrinkagecontrols and material/process levers. Validatewith inline metrology.

Metrology and inspection; DeploySAMIR microscopy and emergingXRD warpage mappingto correlate process defects and reliability.

Minimum Qualifications:

MS or PhDin Materials Science Chemical Engineeringor relatedfield

10 yearsexperience in advanced packaging technology development (2.5D/3D HBM)

Hands-on knowledge ofadvanced interconnects/TSVdie stackingunderfillmolding andbondingflows

ProficiencyinDOE/SPCand data analysis (e.g.JMP/Minitab/Python);demonstratedroot-causeproblem solving and yield improvement.

Experience withmetrology: SAM Xray/CT IR warpage profilers (shadow moiré/DIC)

Strong communicationskills; ability toleadcross-functionalteamsand drive actions to closure infast-pacedenvironments.

Direct experience withhybrid bondingintegration and reliability (W2W/C2W)

Demonstrated success inHBM and logicintegration(includingthermalco-optimization)

Warpage modelingand inline correlation experience

Deep familiarity with underfills reworkable strategies and TC bonding optimization

Candidates must have experience and the ability to adhere to cleanroom environment/EHS protocols. This role entails occasional travel to sites in Asia for integrationdevelopmentandtransfersupport.

As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.

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Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However all information provided must be accurate and reflect the candidates true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology Inc.

Required Experience:

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.D...