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Role Summary
As a Member of Technical Staff (MTS) Process Integration Engineer within APTD you will lead initiatives focused on developing and enabling advanced packaging technologies for new and emerging integration projects. Your work will ensure that products leveraging these technologies meet performance cost manufacturability quality reliability and schedule requirements. This role requires close collaboration with peers internal partners and external suppliers to coordinate development and successful deployment of next-generation packaging solutions.
Key Responsibilities
Technology Development & Integration
Develop and enable advanced packaging technologies that deliver cost-effective solutions with predictable reliability.
Collaborate with peers to establish project timelines and verify work needed to meet objectives.
Partner with internal teams and external suppliers to develop new capabilities required for advanced packaging solutions.
Product Transition & Qualification
Ensure smooth transition from new product development and qualification to small-volume and high-volume production.
Provide proper Plan of Record (POR) documentation for product transfer to manufacturing.
Work with internal teams to support new product and technology transfers.
Future Capability Planning
Anticipate packaging needs and develop capabilities ahead of demand.
Monitor industry trends and define future roadmaps for packaging technologies.
Collaborate with peers and internal teams to implement new capabilities aligned with strategic goals.
Management & Communication
Identify areas for improvement and propose systematic solutions.
Adapt communication style to engage and motivate teams effectively.
Fulfill formal communication and coordination responsibilities across work units.
Maintain frequent communication with peers and team members under your guidance.
Continuously develop knowledge and skills to meet organizational needs.
Safety & Compliance
Promote and enforce safe compliant behavior through regular communication and performance management.
Review and respond to reports from supervisory staff EHSS teams and auditors.
Conduct work area inspections and operational observations.
Maintain area procedures and training to ensure legal compliance and adherence to management systems.
Requirements
B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering Mechanical Engineering Chemical Engineering Physics Material or other related technical fields
10 years of semiconductor process integration experience preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes
Proficiency in Python R SQL for statistical analysis process modeling and data analytics.
Experience with Visual Basic for automation and tool integration.
Familiarity with E3 FDC (Fault Detection and Classification) and RMS (Recipe Management System) for equipment and process control.
Strong data analytics capabilities to support SPC DOE defect analysis and dashboarding.
Strong understanding of process flows process interactions and ability to integrate semiconductors while partnering with process and product engineering team
Ability to resolve complex issues through root-cause or model-based problem solving
Tenacity to work effectively under timelines and limited resources
Consistent track record to solve problems and address root causes
About Micron Technology Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.
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