Package Design Engineer
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Job Location:
Charlotte, VT - USA
Monthly Salary:
Not Disclosed
Posted on:
5 hours ago
Vacancies:
1 Vacancy
Job Summary
Job Summary
As a Package Design Engineer you will be responsible for the design simulation and optimization of sophisticated packaging methods for high-performance electronics. You will work with cross-functional teams to guarantee that our products meet reliability thermal and electrical performance standards while driving innovation in semiconductor packaging. This role provides an excellent opportunity to work on next-generation technologies in a fast-paced collaborative setting.
Key Responsibilities
- Use tools like Cadence Ansys or Siemens EDA to design and create integrated circuit packaging solutions such as substrate layouts interconnects and thermal management systems.
- Validate package designs by simulating signal integrity power supply and thermomechanical stress.
- Work with the R&D manufacturing and testing teams to prototype and iterate package architectures.
- Analyze failure modes and make recommendations to increase yield and dependability.
- Keep up with industry trends in advanced packaging (e.g. 2.5D/3D integration fan-out wafer-level packaging) and incorporate them into projects.
- Document designs generate technical reports and assist with patent filings as needed.
- Ensure compliance with industry standards (such as JEDEC) and environmental legislation.
Skills
- Experience with EDA tools for package design (e.g. Allegro SiP Layout) and simulation software (e.g. HFSS PowerSI).
- A thorough understanding of electrical thermal and mechanical principles in packaging.
- Knowledge of materials science including substrates underfills and encapsulants.
- Outstanding problem-solving and analytical abilities.
- Excellent communication abilities for explaining complicated technological concepts to non-experts.
- Experience with scripting (Python MATLAB) for automation is advantageous.
- Ability to work in a team-oriented deadline-driven environment.
Education & Experience
- A bachelors degree in electrical engineering materials science or a related discipline (a masters or PhD is desirable).
- Three or more years of hands-on experience in IC package design preferably in semiconductor or electronics production.
- Proven experience with innovative packaging technologies in a professional or academic setting.
- Work permission in the United States is required; there is no visa sponsorship.
Annual Pay
The base income ranges from $120000 to $160000 depending on experience location and credentials. This range illustrates our commitment to providing competitive compensation for outstanding individuals in the United States.
Compensation & Benefits
- *Performance Bonus:* Up to 15% of base salary subject on individual and corporate goals.
- *Equity:* Stock options or RSUs to contribute to our success.
- *Health Benefits:* Medical dental and vision coverage begins on day one with employer contributions.
- *Retirement:* 401(k) matches up to 6% of your earnings.
- *Paid Time Off:* Includes 20 days of PTO 10 paid holidays and flexible sick leave.
- *Professional Development* includes tuition reimbursement conference attendance and ongoing training.
- *Work-Life Balance:* Hybrid/remote choices (for United States residents) wellness programs and parental leave.
- Other perks include gym membership reimbursement commuter benefits and employee help programs.
Key Skills
- Load & Unload
- Ruby
- Shipping & Receiving
- Forklift
- Lift Truck Experience
- Basic Math
- Packaging
- Warehouse Experience
- Delivery Driver Experience
- Heavy Lifting
- Human Resources
- RF Scanner
