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The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as artificial intelligence/machine learning AI/ML cloud computing wireless infrastructure and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects.
We are seeking an experienced SI/PI engineer to develop our next generation products with a focus on parallel interfaces. The job requires aspects of both a successful AE and R&D engineer. The candidate will work on a mix of customer products and development of new interconnect technologies and IP in the MCM 2.5D and 3D spaces working alongside R&D IP development customers and manufacturing partners.
This is an exciting opportunity to develop new ideas design the next generation of leading edge ASIC products and work on the most advanced technologies in the industry.
Responsibilities:
Mask based timing signoff using time domain simulations (SPICE etc.) of parallel interfaces including 2.5D and 3D.
Electromagnetic extraction and modeling of signal and power delivery channels (PCB Package Interposers etc.).
AC and transient analysis of Power Distribution Networks.
IO channel analysis.
Pre-layout modeling of transceivers as well as signal and PDN networks.
Automate sign-off processes and work with EDA suppliers to improve tool accuracy and analysis flow.
Generate analysis results create presentations sign-off reports and support pre-sales activities to both customers and internal teams.
Skills and Experience:
Independent self-starter who can work across a worldwide organization and customer base.
Ability to manage multiple concurrent customers under short timelines.
Comfortable with providing guidance and direction with incomplete information.
Knowledge of at least one DDR/LPDDR and/or HBM SI/PI sign-off flow tool suite.
Ability to manage analysis documentation and presentation roles.
Flexibility to integrate new ideas and tools to enhance signoff capabilities.
Experience with various IC Package and PCB database types.
TCL Python scripting experience to automate routine tasks.
Education/Experience:
Bachelor in Electrical/Electronics/Computer Engineering and 8 years related experience OR Masters Degree in Electrical/Electronics/Computer Engineering and 6 years related experience.
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $120000 - $192000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical dental and vision plans 401(K) participation including company matching Employee Stock Purchase Program (ESPP) Employee Assistance Program (EAP) company paid holidays paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race color creed religion sex sexual orientation national origin citizenship disability status medical condition pregnancy protected veteran status or any other characteristic protected by federal state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA please be sure to fill out a home address as this will be used for future correspondence.
Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor, enterprise software and security solutions.