Amazon Leo is Amazons low Earth orbit satellite network. Our mission is to deliver fast reliable internet connectivity to customers beyond the reach of existing networks. From individual households to schools hospitals businesses and government agencies Amazon Leo will serve people and organizations operating in locations without reliable connectivity.
As a Product Engineer you will engage with an experienced cross-disciplinary staff to conceive design and manufacture innovative semiconductor solutions for Amazon Leos satellite and ground products. You will work closely with internal inter-disciplinary teams and third-party suppliers to drive key aspects of semiconductor product manufacturing test qualification and reliability to meet our customers needs. You must be responsive flexible and able to succeed within an open collaborative peer environment.
Export Control Requirement
Due to applicable export control laws and regulations candidates must be a U.S. citizen or national U.S. permanent resident (i.e. current Green Card holder) or lawfully admitted into the U.S. as a refugee or granted asylum.
Key job responsibilities
In this role you will:
- Drive test program reviews with design test and system teams.
- Define qual plans based on evaluation of mission profile and execute to defined qual plans with outsource partner.
- Identify root cause and drive fixes for any failures reported during qual.
- Collaborate with TE and outsource partner in test program bring-up and evaluation.
- Analyze bench-ATE correlation data and implement appropriate offsets / transforms.
- Complete char data guardbanding and finalize test program limits with appropriate guardbands and confirm compliance to system specs.
- Interface between outsource partner and design / test teams to identify bugs and support fixes during product bring-up.
- Drive test-time reduction by RF-DC and FT-WS correlation and reject-oriented analysis.
- Define test plans and limits for production lots corners lots and pre-/post-qualification lots based on system specs and yield & Cpk targets.
- Bachelors degree in Electrical Engineering or a related field
- 7 years of experience in semiconductor product engineering or foundry process operations preferably in high-volume wireless RF front-end devices and Antenna-in-Package manufacturing.
- Up to 20% domestic or international travel required.
- Masters degree in Electrical or Communications Engineering or a related field
- Excellent oral and written communications skills.
- Strong technical background in on or more of the following:
- RF product development and characterization experience.
- Knowledge of digital testing.
- Experience interfacing with suppliers and external partners.
- Proficiency in statistics data analysis and YMS products such as Exensio and JMP scripting skills preferred.
- New product introduction with transition from design phase through qualification and into high volume manufacturing environment.
- Conversant with failure analysis techniques such as FIB SEM IR EMMI and CSAM.
- Knowledgeable with package technologies such as FCBGA FCCSP WLCSP and QFN.
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit
for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $129800/year in our lowest geographic market up to $212800/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge skills and experience. Amazon is a total compensation company. Dependent on the position offered equity sign-on payments and other forms of compensation may be provided as part of a total compensation package in addition to a full range of medical financial and/or other benefits. For more information please visit This position will remain posted until filled. Applicants should apply via our internal or external career site.