Advanced Package Technology Principal Engineer

About Marvell

Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI and carrier architectures our innovative technology is enabling new possibilities.

At Marvell you can affect the arc of individual lives lift the trajectory of entire industries and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation above and beyond fleeting trends Marvell is a place to thrive learn and lead.

Your Team Your Impact

What You Can Expect

What Were Looking For

• Experience in advanced package and substrate technologies with deep understanding of process and materials component and board level reliability warpage and thermal management.

• Experience in managing substrate and assembly material vendors substrate manufacturers OSATs and foundries.

• Bachelors degree in Mechanical Engineering Material Science Electrical Engineering or related fields and 10 years of related professional experience. OR Masters degree and/or PhD in Electrical Engineeringechanical Engineering Material Science or related fields with 5 years of experience.

Skills needed to be successful in this role:

• Deep understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L (b) EMIB (c) CPO (d) CPC.

• Strong understanding of chip-package interactions and failure mechanism at component and board level thermal and warpage management.

• Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.

• Ability to influence suppliers to align their roadmap with company goals.

• Strong communication presentation and documentation skills

The ideal candidate would have:

• Experience setting roadmaps not just executing them.

• Demonstrated leadership driving cross-company supplier programs.

• Prior experience in data center AI accelerators networking silicon or custom HPC silicon.

• Ability to influence senior stakeholders across architecture silicon design system platform engineering and supply chain

• Understanding of component (substrate interposer etc.) and package designs.

• Knowledge of signal integrity and power integrity.

• Board and system level integration.

• Experience with silicon disaggregation and reaggregation and memory integration.

Expected Base Pay Range (USD)

The successful candidates starting base pay will be determined based on job-related skills experience qualifications work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race color religion sex national origin sexual orientation gender identity disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at .

Interview Integrity

As part of our commitment to fair and authentic hiring practices we ask that candidates do not use AI tools (e.g. transcription apps real-time answer generators like ChatGPT CoPilot or note-taking bots) during interviews.

Our interviews are designed to assess your personal experience thought process and communication skills in real-time. If a candidate uses such tools during an interview they will be disqualified from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations including the Export Administration Regulations (EAR). As such applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens lawful permanent residents or protected individuals as defined by 8 U.S.C. 1324b(a)(3) all applicants may be subject to an export license review process prior to employment.