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Physical Design Implementation: An ideal candidate having strong background in either the Physical Design which includes floor planning placement design closure STA and DRC & LVS skills.
Overall candidates are expected to develop the most of above skills. Candidates who have the desire to seek the in-depth and broad technical challenge should apply.
It would be better if the candidate have the experience running full chip signoff tasks including PI SI PV and STA.
Requirements/Qualifications
- Candidates should have good understanding about ASIC design flow and solid VLSI background.
- Candidates should be able to handle block implementation/top level task independently.
- Tapeout experience in 7nm and blow process design.
- Candidate s should have strong communications and problem solving skills.
- Candidates with experience in any one of following knowledge are a plus
- DFT insertion
- Power/IVD analysis
- DRC/LVS
- STA
- Candidate is good at Perl/Tcl
Education/Certifications
Preferred Degree: 7 years MS Preferred
Major: Microelectronics or related discipline
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race color creed religion sex sexual orientation national origin citizenship disability status medical condition pregnancy protected veteran status or any other characteristic protected by federal state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor, enterprise software and security solutions.