TD Design Collateral Modeling Engineer

Solidigm

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profile Job Location:

Rancho Cordova, CA - USA

profile Monthly Salary: Not Disclosed
Posted on: 30+ days ago
Vacancies: 1 Vacancy

Job Summary

A TD Design Collateral Modeling Engineer is responsible for creating and refining models and data related to the design including but not limited to CMOS Spice models NAND array and interconnect RC models.

Key Responsibilities:

  • Model development: design and maintain modeling tiles on test chip and product scribes perform electrical validations on silicon generate device and interconnect RC models calibrate models with corners based on fab process targets and variations.
  • Cross-functional collaboration: work closely with Device Design PI and Process engineers to solve device and model related issues meeting NAND performance target passing technology qualifications.

Qualifications :

Required:

  • BS MS or PhD in a science or engineering field and minimum 5 years of experience in research or development environment for the relevant technical areas are required
  • Hands-on expertise in device modeling tools such as Verilog-A or similar simulation platforms
  • Strong understanding of semiconductor physics particularly CMOS transistor operation and device scaling principles. 
  • Strong communication and collaboration skills to work effectively with cross-functional teams. The candidate will need to be a collaboration role model establishing strong technical and personal credibility ensuring on-time project success through influencing and working with other organizations
  • Excellent statistical data analysis and problem-solving skills 

Preferred:

  • Hands-on expertise in electrical characterization techniques like IV curves capacitance-voltage measurements and device modeling. 
  • Proficiency in TCAD simulation tools for device design and analysis 
  • Experience with semiconductor fabrication processes 
  • Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking

Working Conditions: This position is primarily office-based. Some international travel is expected.


Additional Information :

The compensation range for this role is $136750 - $252010. Actual compensation is influenced by a variety of factors including but not limited to skills experience qualifications and geographic location. 

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Remote Work :

No


Employment Type :

Full-time

A TD Design Collateral Modeling Engineer is responsible for creating and refining models and data related to the design including but not limited to CMOS Spice models NAND array and interconnect RC models.Key Responsibilities:Model development: design and maintain modeling tiles on test chip and pro...
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Key Skills

  • Mechanical Design
  • SOC
  • System Design
  • GD&T
  • CAD
  • Creo
  • SolidWorks
  • Mechanical Engineering
  • Perl
  • Autocad
  • HVAC Design
  • Catia

About Company

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with ... View more

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