Process Engineer
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Job Location:
San Francisco, CA - USA
Monthly Salary:
Not Disclosed
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
Apples ATG Sensing Group is looking for a senior level electronic packaging engineer to work on developing exciting new products. This role will be responsible for providing module packaging solutions to be integrated in systems for consumer markets. This role will be working with internal device design product design operation as well as external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are innovative as well as experienced in a high volume manufacturing environment.A successful candidate should have a proven track record of successfully shipped products with 3rd party manufacturing partners. Candidate must demonstrate the ability to lead cross functional teams to success. Candidate should be experienced with operating independently as well as collaboratively in a complex multi-disciplinary development program.
- BS and 10 years of relevant industry experience.
- Understand and keep up-to-date with industry landscape on relevant technologies.
- Strong interpersonal and team-building skills.
- Proven track record of work with OSAT to bring up a product from conceptual to MP stage.
- Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging interactions and reliability failures.
- Proficient in applying DOE vs. Hypothesis tool for root cause analysis.
- Excellent written and verbal communication skills.
- In-depth knowledge in the area of semiconductor sensor packaging technologies.
- Expert-level knowledge in assembly steps: wafer thinning wafer dicing die attach (including flip chip and multi-die stacking) wirebond encapsulation and underfill SMT transfer/compression molding singulation and wafer level packaging processes.
- Working level knowledge in wafer bumping RDL and TSV.
- Experience in using simulation to guide process setup.
- Experience in using AI to support process development.
- Experience in capacitive sensing module packaging.
- Experience in customer facing cosmetic packaging.
Key Skills
- Lean Manufacturing
- Six Sigma
- Distributed Control Systems
- Continuous Improvement
- Process Improvement
- Minitab
- Root cause Analysis
- Process Engineering
- cGMP
- Kaizen
- Programmable Logic Controllers
- Manufacturing
About Company
Ask Siri to name the most successful company in the world and it might respond: Apple. And it's not just out of familial pride. Apple consistently ranks highly in profit, revenue, market capitalization, and consumer cachet. In 2018, the company became the first reach a trillion dollar ... View more
