Silicon Photonics & Optical Packaging Eng
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Job Location:
San Francisco, CA - USA
Monthly Salary:
Not Disclosed
Posted on:
14 days ago
Vacancies:
1 Vacancy
Job Summary
Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
- BS and 10 years of experience in relevant industry experience
- M.S or Ph.D. in Physic (Optics major) Electrical Engineering Materials Science Mechanical Engineering or an equivalent field desired preferred.
- Excellent teamwork and communication skills.
- Strong theoretical background in optics and photonics fundamentals device/module integration.
- Hands-on experience in packaging and measuring fiber-coupled devices.
- Hands-on experience in optical component design simulation and qualification and single / multi-mode fiber assembly using active and passive alignment tool.
- Min. 5 years works experiences in the related field with M.S and or Ph.D.
- Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC CoW WLP )
- Experience with silicon photonics device laser modulator PD passive components such as Si WG MUX/DeMUX is a plus.
Key Skills
- Business Continuity Planning
- Active Directory
- C
- Higher Education
- AC Maintenance
- Analytics
About Company
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