Advanced Packaging Modeling Expert FEA

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.

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• About the Role

  We are looking for an expert highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team in Santa Clara CA. This is a critical role focused on developing thermal-mechanical simulations to support the design development and qualification of next-generation semiconductor packaging technologies. You will play a key role in shaping the future of advanced packaging by providing simulation-driven insights that influence architecture materials and process decisions.

  This position offers the opportunity to work at the forefront of semiconductor innovation collaborating with engineers and researchers across multiple business units including design process integration reliability and manufacturing.

  Key Responsibilities

  • Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.

  • Perform simulations to evaluate stress strain warpage delamination thermal cycling and reliability risks across a wide range of package architectures (e.g. flip-chip fan-out 2.5D/3D IC chiplet-based designs TSVs).

  • Conduct thermal modeling to assess heat dissipation in complex package structures supporting thermal design optimization and advanced cooling technology development.

  • Collaborate with cross-functional teams to define simulation requirements interpret results and provide actionable design and process recommendations.

  • Support technology roadmap development by evaluating new materials interconnect structures and process flows from a thermo-mechanical reliability perspective.

  • Drive design-of-experiment (DOE) studies and sensitivity analyses to understand key drivers of package performance and reliability.

  • Contribute to the development and automation of internal simulation workflows tools and best practices to improve modeling efficiency and accuracy.

  • Document and present simulation methodologies results and recommendations to both technical and executive audiences.

  • Stay current with industry trends emerging technologies and academic research in advanced packaging and simulation methodologies.

• Required Qualifications

  • M.S. or Ph.D. in Mechanical Engineering Materials Science Applied Physics or a related field.

  • 5 years of hands-on industry experience inthermal-mechanical FEA modeling in the semiconductor or electronics packaging domain.

  • Thorough understanding ofadvanced packaging technologies including flip-chip fan-out wafer-level packaging (FOWLP) 2.5D/3D integration chiplet architectures and through-silicon vias (TSVs).

  • Proficient with commercial FEA tools such asANSYS Abaqus COMSOL or equivalent.

  • Strong knowledge ofmaterials behavior including polymers metals ceramics and their interactions under thermal and mechanical loads.

  • Familiarity withsemiconductor packaging processes including die attach underfill molding bumping and reflow.

  • Excellent analytical problem-solving and communication skills.

  • Proven ability to work independently and collaboratively in a fast-paced cross-functional environment.

  Preferred Qualifications

  • Experience withmulti-physics simulations including coupled electro-thermal-mechanical analysis.

  • Familiarity withJEDEC reliability standardsand qualification tests (e.g. TCoB HTS uHAST drop test).

  • Experience withscripting and automation(e.g. Python TCL MATLAB) to streamline simulation workflows.

  • Exposure topackage design toolssuch as Cadence Mentor Graphics or equivalent.

Additional Information

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The salary offered to a selected candidate will be based on multiple factors including location hire grade job-related knowledge skills experience and with consideration of internal equity of our current team addition to a comprehensive benefits package candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program as applicable.

For all sales roles the posted salary range is the Target Total Cash (TTC) range for the role which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.

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