Principal Process Engineer, Die Bonding

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D equipment and materials suppliers and manufacturing teams we ensure the efficient development transfer and implementation of new technology nodes maintaining Microns leadership in the industry.

As a Principal Process Engineer in Die Bonding you will be primarily responsible for starting up developing and optimizing processes to improve product quality and reliability working on process yield improvement cost reduction productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify diagnose and resolve assembly process related problems by applying failure analysis FMEA 8D or SPC/FDC methodology.

Responsibilities:

• Develop diagnose and resolve various die bonding process technologies

• Coordinate and execute process equipment and material evaluation/optimization initiatives and implement changes at process step

• Lead and participate in continuous yield improvement and cost reduction activities

• Validate and fan out new process baseline qualified including new process tools and/or materials for new product introduction

• Manage audit and be a liaison with material suppliers to achieve quality cost and risk management objectives

• Support SPC/FDC/RMS/APC and site-to-site portability

• Support internal and external audits

Minimum Qualifications:

• A BS degree with minimum 8 years proven experience in Semiconductor Process Engineering

• Solid engineering knowledge of semiconductor advanced packaging die stacking processes

• Skilled at designing valid tests and Design of Experiments (DOE)

• Excellent data collection organization and analysis skills plus proficiency in data analysis techniques/programs

• Excellent oral and written communication skills and a strong attention to detail

• Highly self-motivated and have the ability to work independently as a group leader and as a collaborative contributor

• Knowledge and an understanding of project management

Preferred Qualifications:

• Masters or Doctorate degree in Engineering Physics or related field

• Experience in working on Die Bonding : Fusion Bonding Hybrid Bonding Direct Bonding or on applications such as MEMS Imager Memory or Heterogeneous Integration

• Bonding experience at a Vendor Research Institute or Semiconductor Industry Equipment Supplier or Integrator

As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.

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