Senior Process Engineer, SMT Process Engineering (IE)

At PepperlFuchs we combine a strong commitment to innovation with a deep respect for the traditions that have shaped our success. From renewable energy and automotive production to water treatment plants and chemical systems our advanced electronic sensors and automation components enable smooth and safe operations around the globe.

We take pride in fostering a supportive and collaborative workplace culture where employees feel connected and valued - much like a close-knit family. As we continue to grow we are excited to welcome a new team member for the following position:

Role Purpose:

Industrialize and deliver PCBA NPI under new ExpressOPS initiatives during product development to achieve manufacturability. Provide R&D with Design for Manufacturing / Assembly (DFM / DFA) inputs perform feasibility studies on PCBA review PCB layout and component specification develop technical processes and tools and establish BoM Structure to provide fast sample delivery.

The engineer participates in Technology projects and Continuous Improvement projects and acts as a technical authority on SMT process feasibility and innovation ensuring seamless collaboration with R&D Technology Development and production teams.

Major Responsibilities:

As part of the Industrial Engineering (IE) Team to deliver PCBA NPI under new ExpressOPS initiatives:

• To industrialize new PCBAs and transfer current PCBAs between locations according to company initiatives Product Engineering Process (PEP) and Production to Production (PTP)
• Responsible as a technical lead of End-to-End prototyping needs of PCBA

As the Subject Matter Expert will be responsible for ensuring manufacturing feasibility study is done before accepting PCBAs for industrialization:

Technical Feasibility & Process Development

• Conduct early-stage technical feasibility assessments of new PCBAs in collaboration with R&D during product design
• Participate and execute the development and validation of new SMT processes and technologies (e.g. LGA UFBGA PoP 0201/01005 components)
• Drive prototyping and pilot builds to evaluate and refine processes prior to volume ramp-up

Collaboration with R&D & PEP Projects

• Act as the process engineering counterpart for PCBAs in PEP (Product Engineering Process) projects from concept through industrialization
• Ensure robust Design for Manufacturing (DFM) input is integrated into PCB and assembly designs early in the development phase
• Provide SMT-specific guidance on PCB layout component footprint design solder joint reliability and stencil design

Process Standardization & Optimization collaboration with Technology Development (TD)

• Execute trials and qualifications for new solder pastes fluxes nozzles reflow profiles etc
• Execute and maintain SMT process standards best practices and design rules in TD projects
• Analyze process data to improve yield cycle time and equipment utilization.
• Participate in continuous improvement projects leveraging Six Sigma SPC DOE or Lean methodologies

Technology Roadmapping & Innovation

• Monitor and evaluate emerging SMT technologies materials and equipment
• Identify opportunities for cost savings or capability expansion through new equipment or process enhancements

Cross-functional Support & Knowledge Sharing

• Collaborate with Maintenance Service Technology Development Procurement and Quality to resolve technical challenges
• Train production and process engineers on new technologies and process changes.
• Document and communicate lessons learned and technical know-how across global teams

You are responsible to provide R&D with DFM / DFA inputs review component specifications and PCB layout to ensure PCBA are manufacturable with sustainable good quality:

• Participate actively in Risk Assessment (DFMEA & PFMEA) and Design of Experiments (DOE)
• Review develop and setup BoM and product structure for new PCBA
• Provide PCBA manufacturing expertise to Business Unit and Production to meet time to market quality and cost

You are responsible together with R&D industrialized PCBAs are passing through relevant laboratory and certification tests:

• Develop and implement quality acceptance methods for samples and prototypes with R&D

You are responsible for conceptualize develop machines and fixtures and release production processes and parameters in Manufacturing Technologies (SMT / THT / COB):

• Develop and optimize stencil designs solder paste printing pick & place programs reflow profiles and AOI/AXI strategies.
• Develop work instructions and methods for new PCBA
• Verify new component solderability process window zero point and pad design
• Develop machine programs and qualifying new process parameters for various types of machines in SMT
• Troubleshoot production processes during actual build to achieve good quality for customer
• Drive root cause analysis and corrective actions for process-related issues

You are the Subject Matter Expert (PCBA) responsible for executing New Technology and Improvement Projects:

• Testing and implementing of new material new tools and new machines (FAT/SAT) with Technology Development and R&D departments in Technology Project Work Packages
• Participate & implement Technology Work Packages at SEA regional level
• Analyze data provide solutions for productivity improvement & structured problem solving

Requirements:

• Minimum a Bachelors Degree in Electronics / Mechatronics Engineering or equivalent education. Experience in PCBA Process development an added advantage
• Minimum 7years of industry experience with hands-on experience in industrialization and development of SMT THT and COB assemblies during product development phase
• Industry experience and hands-on in:
  • SMT technologies and setting up machine programs (Pick&Place Stencil Development Solder Paste Printing Solder Paste Inspection Reflow Soldering Profile Development Glue Jetting V-groove and Router Depaneling Wave and Selective Soldering)
  • COB technologies and setting up machine programs (Die Attach Wire Bond GlobTop)
  • Soldering technologies and setting up machine programs (Wave Soldering Selective Soldering Reflow Soldering Manual Soldering and Rework Soldering of electronic assemblies)
• Familiarity with IPC standards (IPC-A-610 J-STD-001 IPC 7711/7721)
• Strong knowledge of SMT equipment (e.g. DEK/MPM printers Fuji/ASM/Panasonic placement machines Heller/ERSA reflow ovens AOI/AXI)t
• Possess good knowledge in FMEA Control plan APQP DFSS and using DOE and SPC to determine the interrelations of process parameters and processes results
• Possess good knowledge and hands-on expertise in any of this statistical data analysis software: Minitab JMP or QS-stat software for process development is an advantage

For further information please contact Ms Jacqueline Lim;-2293;

Are you excited about this opportunity We cant wait to get to know you! Submit your application online were looking forward to hearing from you!

PepperlFuchs actively promotes diversity equity and inclusion and is committed to a policy of equal employment opportunity. We welcome applications from all individuals regardless of ethnicity country of origin gender religion sexual orientation age skin color physical or mental abilities social background or any other protected characteristic. All employment decisions are made based on these principles and in full compliance with applicable federal and state laws.