drjobs Principal Application Engineer, Advanced Packaging Materials

Principal Application Engineer, Advanced Packaging Materials

Employer Active

1 Vacancy
drjobs

Job Alert

You will be updated with latest job alerts via email
Valid email field required
Send jobs
Send me jobs like this
drjobs

Job Alert

You will be updated with latest job alerts via email

Valid email field required
Send jobs
Job Location drjobs

Irvine, CA - USA

Monthly Salary drjobs

$ 125000 - 150000

Vacancy

1 Vacancy

Job Description

Principal Application Engineer Advanced Packaging Materials

Irvine California United States

$125000 to $150000 Bonus Full Benefits Paid Relocation

Overview

This role is for a Principal Application Engineer to join a global organization focused on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies space specifically supporting the electronics market. The position involves providing high-level technical engineering support developing in-depth application expertise and directly engaging with key customers.

Key Responsibilities

  • Technical Leadership: Serve as the technical lead on developmental and commercialized products by optimizing material application processes.

  • Customer Interaction: Directly interact with customers to troubleshoot and solve product and process-related problems.

  • Value Creation: Ensure that new and existing products can be successfully employed by customers in a manner that brings clear and identifiable value.

  • Problem Solving: Solve technology-specific fundamental problems associated with entire product lines and/or product classes using novel approaches to application process development troubleshooting and material characterization.

  • Travel: Traveling of up to 10% will be part of this role.

What Makes You a Good Fit (Required Qualifications)

  • Education: Minimum of a Bachelors degree in Material Science/Engineering Mechanical Engineering Chemical Engineering or other related fields.

  • Experience: 10 years of experience working in a chemical environment for semiconductor advanced packaging.

  • Technical Expertise:

    • Good understanding of the latest Semiconductor Packaging trends especially 2.5D and 3D package.

    • Expertise in wafer level encapsulation and molding process in semiconductor package.

  • Communication: Strong verbal communication skills (one-on-one and group presentations) with solid interpersonal skills.

  • Work Style: Strong ownership and responsibility with a customer-oriented mindset effective in using project and time management skills to drive projects to completion and the ability to work as a team member and independently.

  • Health Insurance: Affordable plans for medical dental vision and wellbeing starting on day 1.

  • Work-Life Balance: Paid time off (sick vacation holiday volunteer time) flexible & hybrid work policies (depending on role) and vacation buy / sell program.

  • Financial: 401k matching employee share plan with voluntary investment / matching shares annual performance bonus service awards and student loan reimbursement.

  • Family Support: 12-week gender neutral parental leave (up to 20 weeks for parents giving birth) fertility support adoption & surrogacy reimbursement discounted child and elderly care and scholarships.

  • Career Growth: Diverse national and international growth opportunities access to thousands of skills development courses and tuition reimbursement.


Required Experience:

Staff IC

Employment Type

Full-Time

Company Industry

Report This Job
Disclaimer: Drjobpro.com is only a platform that connects job seekers and employers. Applicants are advised to conduct their own independent research into the credentials of the prospective employer.We always make certain that our clients do not endorse any request for money payments, thus we advise against sharing any personal or bank-related information with any third party. If you suspect fraud or malpractice, please contact us via contact us page.