You will be responsible for Package design and design flow development for advanced packaging technologies in a cross-functional team. Other responsibilities include advanced packaging CAD flow set-up CAD tool bring-up and related areas.
- BS and 10 years of experience in relevant industry experience.
- 10 years in a Si fab integration role with 5 years in advanced packaging preferred.
- PhD in Physics EE Mech E Chemistry and related fields.
- Silicon fab interconnect process integration experience in BEoL process RDL fine pitch µ-bumps hybrid bonds TSVs etc.
- Deep knowledge of electrical mechanical and thermal properties of fab materials
- Strong expertise in Si Fab equipment and Fab Logistics Management
- Experience on advanced packaging for leading edge CMOS nodes
- Expertise on Si structure yield and reliability mechanisms and analyses
- Good familiarity with electrical mechanical and/or thermal characterization failure analysis
- Tool experience: One or more of TCAD JMP Virtuoso KLayout Ansys EDT
- Capable of independent R&D Work in a cross-functional team driving vendors
- Excellent communication and people skills
You will be responsible for Package design and design flow development for advanced packaging technologies in a cross-functional team. Other responsibilities include advanced packaging CAD flow set-up CAD tool bring-up and related areas.BS and 10 years of experience in relevant industry experience.1...
You will be responsible for Package design and design flow development for advanced packaging technologies in a cross-functional team. Other responsibilities include advanced packaging CAD flow set-up CAD tool bring-up and related areas.
- BS and 10 years of experience in relevant industry experience.
- 10 years in a Si fab integration role with 5 years in advanced packaging preferred.
- PhD in Physics EE Mech E Chemistry and related fields.
- Silicon fab interconnect process integration experience in BEoL process RDL fine pitch µ-bumps hybrid bonds TSVs etc.
- Deep knowledge of electrical mechanical and thermal properties of fab materials
- Strong expertise in Si Fab equipment and Fab Logistics Management
- Experience on advanced packaging for leading edge CMOS nodes
- Expertise on Si structure yield and reliability mechanisms and analyses
- Good familiarity with electrical mechanical and/or thermal characterization failure analysis
- Tool experience: One or more of TCAD JMP Virtuoso KLayout Ansys EDT
- Capable of independent R&D Work in a cross-functional team driving vendors
- Excellent communication and people skills
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