As a Hardware Reliability Engineer youll be responsible for identifying high-risk failure modes early in the design process and working closely with design engineering teams to reduce those risks. Youll create new reliability tests based on the physics of failure and anticipated user behavior ensuring our systems meet the highest standards. Youll also develop and deliver critical test equipment and specifications and collaborate with vendors to meet testing deadlines. Additionally youll support failure analysis efforts offering design recommendations based on your evaluation of test data to drive continuous product improvements. You bring exceptional problem-solving skills and technical expertise including: - A deep understanding of material and device properties (mechanical electrical optical thermal) and the underlying physics - Proficiency in statistical data analysis and clear reporting providing design risk assessments and guiding product improvements - Strong theoretical knowledge in physical failure analysis techniques such as SEM/EDX/X-Ray and other characterization techniques - Proven ability to develop new reliability test procedures create detailed test plans and analyze results to assess design risks
Bachelors Degree in technical field (mechanical engineering materials engineering electrical engineering physics or related fields etc.)
2 years of experience in an engineering role
Collaborative attitude and ability to cross-functionally work effectively
Good written and verbal English communication skills. Ability to effectively communicate through email WebEx and phone
Ability to make clear and concise slides and presentations through keynote excel etc.
Strong attention to detail and curiosity of how technologies work
Able to use basic productivity apps such as email web browser calendar WebEx/Zoom spreadsheet keynote/ppt etc.
Ability to travel internationally without restriction
Statistical experience such as Weibull JMP or familiarity with accelerated test models
Familiar with Failure Analysis techniques (Optical Microscopy X-ray/CT Scanning Electron Microscopy/Energy Dispersive Spectroscopy etc.) and the ability to use failure analysis methodology to derive a root cause of failure
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