Design Release Engineer Upper Body
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Job Location:
Auburn Hills, MI - USA
Monthly Salary:
Not Disclosed
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
- Lead and mentor a team of 5 engineers in BIW design CAD modeling and release processes
Manage resource planning workload allocation and technical reviews across the team
Collaborate with Advanced Manufacturing to identify and resolve tooling/assembly issues before Tool Kick-Off
Interface with CAE (Durability Safety NVH) to review results and drive design changes
Support supplier meetings APQP processes and cost/timing discussions with release engineers
Lead cost roll-ups and work with suppliers on cost optimization
Drive milestone readiness and oversee release of Upperbody Complete at each program gateway
Document and communicate risks issues and resolutions to leadership
Qualifications :
Bachelors or Masters in Mechanical Engineering
5 years of automotive BIW engineering experience (design release program execution)
Strong leadership and team management background
Proficiency with CAD and PLM tools (CATIA V5 NX Teamcenter)
Knowledge of GD&T DVP&R DFMEA and BIW manufacturing processes
Excellent problem-solving communication and cross-functional collaboration skills
Nice to Have:
Experience with Stellantis programs or other major OEMs
Familiarity with stamping feasibility welding processes and sealing systems
Background in cost management and supplier collaboration
Additional Information :
- All your information will be kept confidential according to EEO guidelines.
Remote Work :
No
Employment Type :
Full-time
Key Skills
- Mechanical Design
- SOC
- System Design
- GD&T
- CAD
- Creo
- SolidWorks
- Mechanical Engineering
- Perl
- Autocad
- HVAC Design
- Catia
About Company
Why join SEGULA Technologies? Take part in the world of the future in an international corporation with strong growth. At SEGULA Technologies, you will work on exciting projects and shape the future in a company for whom innovation and engineering are inseparable. Subjects like 3D pr ... View more
