Silicon Photonics Flip-Chip Bonding Process Engineer
Silicon Photonics Flip-Chip Bonding Process Engineer
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Salary Not Disclosed
1 Vacancy
Job Description
- BS degree in Optical Engineering Electrical Engineering Physics or similar engineering field.
- Background in semiconductor process integration particularly in the back-end section of the manufacturing process.
- 3 years of relevant industry experience.
- MS degree in Optical Engineering Electrical Engineering Physics or similar engineering field with a background in semiconductor processing/fabrication.
- Hands-on experience with die bonder tools and processes or similar high precision assembly tool (flip-chip eutectic AuSn bonding experience beneficial).
- Experience working in a cleanroom environment setting.
- Strong problem solving ability and experience with material inspection e.g. optical microscopes metrology tools etc.
- Electrical and optical test experience.
- Knowledge of statistical data analysis with expertise in using relevant tools (e.g. JMP).
- Excellent communication skills with the ability to work effectively in a team with diverse expertises.
Employment Type
Full Time
