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You will be updated with latest job alerts via email$ 224000 - 224000
1 Vacancy
Date Posted:
Country:
United States of AmericaLocation:
CA601: Goleta (EW) Bldg H01 6380 Hollister Avenue Building H01 Goleta CA 93117 USAPosition Role Type:
OnsiteU.S. Citizen U.S. Person or Immigration Status Requirements:
The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required as only U.S. citizens are eligible for a security clearanceSecurity Clearance:
DoD Clearance: SecretAt Raytheon the foundation of everything we do is rooted in our values and a higher calling to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of todays mission and stay ahead of tomorrows threat. Our team solves tough meaningful problems that create a safer more secure world.
Raytheon is seeking a Principal Mechanical Engineer to lead new product development within the Electronic Warfare Mechanical Design Hardware Department. The section specializes in the design integration verification and production of digital processor and RF receiver subsystems for airborne platforms. The candidate oversees the mechanical development supporting a variety of programs in Goleta California. Key interfaces will be with other sections across the Department other Engineering disciplines as well as internal customers leading the supporting programs.
What You Will Do
The Principal Engineer is a key technical contributor to the programs and products supported by the department. These activities may include designing RF systems for challenging thermal and high vibration environments. This candidate will lead programs as a Responsible Engineering Authority (REA) or Integrated Product Team Lead (IPTL) and serves as a liaison to programs ensuring program success along technical cost and schedule parameters as well as overseeing junior engineers job assignments and performance.
This role also requires the candidate to possess working knowledge of electronics packaging design and manufacturing. This knowledge set includes but is not limited to thermal and structural design and analysis electrical component design construction and failure modes printed wiring board and circuit card assembly processes and best practices surface mount and through hole component installation processes and failure modes metal fabrication and finishing methods RF isolation mechanical design and environmental test methods and equipment. Candidate will also have working knowledge of electronics/processor systems design and development utilizing COTS/MOTS components and products.
You must have an outstanding ability to provide technical guidance and act as a mentor to his/her matrix team. The candidate must be adept at making technical presentations and at establishing customer relationships. The candidate shall be a highly motivated self-starter able to lead by example possessing strong interpersonal written and verbal communication skills and maintain positive relationships and satisfaction with functional and program leadership.
Qualifications You Must Have:
Typically requires a degree in Science Technology Engineering or Mathematics (STEM) and a minimum of 8 years of prior relevant experience unless prohibited by local laws/regulations.
Minimum 8 years experience with Mechanical Design Development and/or Implementation of Defense related Electronic Systems OR 5 years with an advance degree.
Experience with Geometric Dimensioning and Tolerancing (GD&T) and ASME drawing and documentation standards and procedures.
Experience with solid modeling with a minimum of three years of creating and documenting mechanical designs in Pro/Engineer/CREO or similar modeling tools.
Qualifications We Prefer
Experience with EW/Radar Systems or RF Products
Experience with Conformal Antenna Array Packaging
Experience with managing budget and schedule (Earned Value Management (EVM)
Previous experience with design reviews including preparation of chart decks generating design artifacts and presenting to customers
Experience with electronics packaging cabling and harness design or printed wiring board designs and routing
Experience with structural and thermal analysis using FEA modeling techniques
Experience developing Basis of Estimate (BOEs) for proposals and providing proposal technical volume leadership
Proficiency with Parts Management and Materials and Process Engineering COTS / MOTS Design and Development
Experience executing root cause analysis and developing effective corrective actions.
Experience interfacing and communicating with customers (internal/external) regarding assessments of program performance (technical cost and schedule)
What We Offer
Our values drive our actions behaviors and performance with a vision for a safer more connected world. At RTX we value: Safety Trust Respect Accountability Collaboration and Innovation.
Relocation Eligibility
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RTX is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation gender identity national origin age disability or veteran status or any other applicable state or federal protected class. RTX provides affirmative action in employment for qualified Individuals with a Disability and Protected Veterans in compliance with Section 503 of the Rehabilitation Act and the Vietnam Era Veterans Readjustment Assistance Act.
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Required Experience:
Staff IC
Full-Time