Packaging Engineer, SiP & Component Productization
Packaging Engineer, SiP & Component Productization
Posted on :
24-08-2025
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1 Vacancy
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Job Description
- Collaborate with cross-functional teams in Asia and the US on the SiP (system-in -package) module projects- Conduct technology risk assessments and lead process/product qualifications- Establish design rules implement process DOE (Design of Experiments) and optimize processes- Ensure proper in-line controls and SPC (Statistical Process Control) implementation before production ramp-up- Generate yield analysis risk assessments root cause analysis and resolve quality issues- Work as a supplier quality development engineer acting as a manufacturing site/ products owner
- Ideal candidate should have around 8 to 15 years of experience in products or process development in Semiconductor IC Packaging Engineering.
- Bachelors or masters degree in engineering Physics or Material Science related fields.
- Strong communication skills with proficiency in spoken and written English
- Demonstrated problem solving skill and leadership skills.
- Experience in managing a team or experience in Assembly R&D team
- Additionally expertise in diverse area such as materials wafer DPS wafer bumping manufacturing or quality engineering would be highly beneficial.
- A team player who is self-motivated result oriented and detail driven
- Willingness to travel across Asia to provide engineering support
- Experience in AIML and lean factory would be a big plus or Knowledge in deep learning (DL) or statistical machine learning (ML) is preferred.
Employment Type
Full-Time
Key Skills
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