DFM Engineer- SiP NPI
DFM Engineer- SiP NPI
Posted on :
24-08-2025
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1 Vacancy
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Job Description
As a SiP NPI Engineer you will play a crucial role in developing next generation SiP process for various of end products. You will be deeply involved from early design phase prove-of-concept phase (POC) multiple NPI build phases and hand over to MP team until risk ramp. During these phases work as the key stakeholder to lead OSATs process team for process development & qualification per projects assigned. You will also be the major contact window to behavior of our team and collaborate with Internal / external X-function responsibilities include but not limited to:- Collaborate with x-function teams to define next-gen SiP architecture based on assessment of functionality / form factor / process capability.- Define general process flow assess process risk per different options co-work with internal RD team or OSAT team for early validation to de-risk and update risk level based on validation result.- Work with internal project management team to define NPI timeline detailed bring up plan formal build plan post build plan and etc.- Take lead the process development in POC build & NPI build drive OSAT process team to bring up each process steps (material down-selection equipment qualification tooling design recipes fine tune) integrate as one robust process flow and deliver SiP with timely manner (based on NPI build plan) & high quality (yield reliability).- Work with EE team & REL teams for process related FA take lead of process trouble shooting commonality study corrective actions and drive till closure.- Drive OSAT team material vendor equipment vendor for potential process yield improvement cost reduction design rule improvement.- 20% domestic / international travel.
- M.S degree in mechanical engineering physics materials science or equivalent with minimum 5 years of experience in IC packaging (for Bachelor 10 years above experience is required).
- General knowledge / experience in overall SiP process panel level or wafer level packaging process including SMT (surface mounting technology) underfill die attach wire bond molding dicing saw Laser and sputter thin-film materials.
- Excellent interpersonal skills with both Mandarin & English.
- Extensive experiences about transferring molding with fine pitch IC or sputter thin film processes for EMI shielding in the context of high-volume semiconductor / packaging / electronics manufacturing.
- Proven track record of leading internal or external team for assembly process development and qualification of semiconductor packages.
- Good understanding and skill for material characterizations semiconductor packaging component failure analysis design for experiments mechanical simulation and data analysis (JMP).
- Ability to work under pressure with a wide range of people with varying degrees of experience.
- Familiar with quality tools including SPC Cpk DOE data distribution data correlation commonality study and etc.
- Experience of coding smart manufacturing digital transformation or AIML is an advantage.
- Apple is an equal opportunity employer that is committed to inclusion and diversity and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.
Employment Type
Full-Time
Key Skills
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