Senior Staff Silicon Photonics Packaging Engineer
Senior Staff Silicon Photonics Packaging Engineer
Employer Active
Job Alert
You will be updated with latest job alerts via email
Share
Job Alert
You will be updated with latest job alerts via email
Job Description
About Marvell
Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI automotive and carrier architectures our innovative technology is enabling new possibilities.
At Marvell you can affect the arc of individual lives lift the trajectory of entire industries and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation above and beyond fleeting trends Marvell is a place to thrive learn and lead.
Your Team Your Impact
Marvell is the leader in data movement interconnects between and inside data centers. We move big data fast around the globe with high quality and reliability. We offer semiconductor components and optical subsystems to our networking original equipment manufacturer (OEM) optical module cloud and telecom service provider customers.What You Can Expect
Develop photonics IC (PIC) and electronics IC (EIC) co-design flow.
Define PIC and EIC IO pad frame and 2.5D interposer floor plan.
Lead PIC and EIC interconnect schematic and layout design process.
Define PIC and EIC hybrid integration packaging design rules process flow and material sets.
Lead optical package development to establish package manufacturability and reliability.
Collaborate with cross-functional teams consisting of Digital and Analog Circuit designers Signal/Power Integrity and substrate layout and system design team.
Drive optical product package qualification activities from initial concept to production.
What Were Looking For
Bachelors degree in Computer Science Electrical Engineering or related fields and 5 years of related professional experience. Masters degree and/or PhD in Computer Science Electrical Engineering or related fields with 3 years of experience
Expertise in designing hybrid multi-chip integration using 2.5D/3D packaging. Direct experience in Si Photonics based packaging design is a plus. Experience in layout desig tools for ICs and or packaging and 2.5D/3D EM simulation tools such as HFSS SI-Wave Momentum IE3D CST PowerSI.
Device or package characterization andtesting as required in the development speed testing background is preferred.
A strong understanding of wafer level packaging process flow.
Direct experience in collaborating with major OSAT for developing advanced packaging technology for high-speed optics and/or electronics IC is a plus.
Ability to work with a large body of data and the necessary statistical analysis tools and the ability to present the data and ideas to a diverse audience.
Effective communication and presentation
Team player. Expected to work with cross-functional team.
Additional Compensation and Benefit Elements
With competitive compensation and great benefits you will enjoy our workstyle within an environment of shared collaboration transparency and inclusivity. Were dedicated to giving our people the tools and resources they need to succeed in doing work that matters and to grow and develop with us. For additional information on what its like to work at Marvell visit our Careers page.
All qualified applicants will receive consideration for employment without regard to race color religion sex national origin sexual orientation gender identity disability or protected veteran status.
#LI-MC2Required Experience:
Staff IC
Employment Type
Full-Time
