Senior Principal Thermal Engineer - Data Center

Description

As a Senior Principal Thermal Engineer you will focus on the alignment of OCI thermal hardware design and the data center physical infrastructure. A mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical Electrical Thermal and Software) to develop thermal solution optimized for the entire stack and effectively manage high performance data centers. You will work with internal and external partners focusing on delivering the next generation of world class hardware and data centers.

United States based; work from home/remote. Some travel could be required. Full-time with full Oracle benefits.

Career Level - IC5

Responsibilities

Primary Responsibilities:

• Collaborate with OCI engineering teams to develop and implement new CFD technologies and methodologies for improving performance and efficiency of OCI platforms and data center infrastructure.
• Technical lead serving as a resident data center mechanical systems and thermal management domain expert.
• Apply engineering cooling methodologies to craft solutions for small and large-scale data center designs.
• Use Computational Fluid Dynamics (CFD) and flow network modeling tools to generate data center digital twin models from chip to external heat rejection solutions.
• Use Computational Fluid Dynamics (CFD) and flow network modeling tools to generate models for OCI high density compute storage and network racks implementing one or more of the following heat rejection methods: air single-phase liquid direct-to-chip immersion or two-phase liquid direct-to-chip immersion.
• Design and conduct experiments for generating and validating accurate CFD models by comparing test results with platform telemetry and facility BMS data.
• Collaborate with various hardware thermal and data center engineering teams to conduct reliability studies debugging and expedited resolution of hardware/data center infrastructure issues.
• Engage with leading CFD software companies to drive their product roadmap to meet OCIs requirements for high density air and liquid cooling solutions.

Additional Responsibilities:

• Collaborate with internal and external partners across the globe to develop platform hardware and data center infrastructure solutions enabling OCI services.
• Lead thermal design reviews and presentations of concepts to peers partner teams and executives.
• Work jointly with multidisciplinary teams consisting of both in-house and external partners in the development of Advanced Cooling Solution (ACS) concept prototypes.
• Engage hardware development organizations to drive concepts to the product roadmap and OCI data center fleet.
• Collaborate with multifunctional engineering groups to deliver hardware and data center sites aligned with thermal specifications.
• Collaborate with firmware and controls engineering teams to create robust thermal control and monitoring systems.
• Conduct design/debug investigations and support failure analysis and resolution activities for platforms and data center infrastructure.
• Design and create thermal characterization test plans. Collaborate with technicians and industry partners to complete tests. Analyze results to validate compliance with platform and data center infrastructure specifications.
• Support the high-level thermal design direction and data center strategy for complex systems ranging from advanced computing (HPC GPU FPGA Accelerators etc.) to general purpose compute storage network and/or other specialized programs.
• Create robust scalable secure and extensible thermal architecture solutions that account for current and anticipated industry/competitive needs.
• Distill and articulate architectural tradeoffs in the thermal space in terms of key metrics such as feasibility performance cost reliability availability and schedule.
• Partner with the platform and data center architects to drive OCI roadmap definitions.
• Acquire and share expert knowledge of multiple technical areas within and across teams working on similar products.
• Look for opportunities to generate intellectual property to help strengthen OCIs position as a leader in cloud computing.
• Drive and influence technology providers and design partners to develop optimal components and solutions to meet the future requirements of the OCI fleet.
• Partner within the industry and standards bodies to create standards and form factors key to next generation solutions.
• Collaborate with the hardware development and data center design and construction teams to ensure seamless transition from architecture to implementation.

Minimum Qualifications:

• 9 years cloud scale provider OR related technical engineering experience AND Bachelors degree in Mechanical Thermal Fluid Science Systems or Aerospace Engineering.
  • OR 6 years related cloud scale provider OR technical engineering experience AND Masters degree in Mechanical Thermal Fluid Science Systems or Aerospace Engineering.
  • OR 5 years related cloud scale provider OR technical engineering experience AND Doctorate degree in Mechanical Thermal Fluid Science Systems or Aerospace Engineering.
• Comprehensive understanding of data center design including compute storage and network rack deployments with a focus on performance dependency related to mechanical and thermal considerations.
• 3 years experience and proficiency in Computational Fluid Dynamics (CFD) analysis.
• Expertise using Cadence Data Center Solution (aka 6SigmaDCX) OR CoolSim OR TileFlow OR AutoDesk CFD OR ANSYS Icepak OR Mentor Graphics FloTHERM.
• Working knowledge and understanding of data center direct-to-chip liquid cooling technologies including using liquid-to-liquid liquid-to-air single-phase and two-phase cooling distribution units cold plates manifolds for hybrid of air and liquid data center cooling.
• Skilled in CFD model validation by aligning experimental results with simulations to ensure accuracy.
• Capability to perform coupled analyses such as thermo-mechanical simulations to understand the impact of temperature on mechanical behavior and stress in electronic components.
• Ability to evaluate optimization methods to improve the thermal performance of electronic cooling finding the best design intercept to for maximize business outcomes.
• Programming capability in MATLAB Python and SQL.

Preferred Qualifications:

• Experience with creating digital twins.
• Experience with machine learning and artificial intelligence.
• Publications in peer-reviewed journals and conferences.
• Experience with data visualization using Tableau PowerBI Oracle Analytics Cloud OR equivalent.
• Communication skills including the ability to clearly express technical concepts in verbal and written forms.
• Experience creating high-level systems concepts documenting and evaluating concepts and providing analysis to other organizations and executives.
• Problem-solving debug and failure analysis skills with a solid understanding of core engineering principles and analytical techniques.
• Experience in thermal design and analysis of compute architecture is desired.
• Working knowledge of mechanical and electrical system design considerations.
• Exposure/hands-on experience with compute-related thermal airflow and liquid cooling characterization and validation testing.
• Some travel (less than 10-percent) domestic/international travel required as appropriate to support design and build activities.
  
  

Qualifications
Disclaimer:

Certain US customer or client-facing roles may be required to comply with applicable requirements such as immunization and occupational health mandates.

Range and benefit information provided in this posting are specific to the stated locations only

US: Hiring Range in USD from: $120100 to $251600 per annum. May be eligible for bonus equity and compensation deferral.

Oracle maintains broad salary ranges for its roles in order to account for variations in knowledge skills experience market conditions and locations as well as reflect Oracles differing products industries and lines of business.
Candidates are typically placed into the range based on the preceding factors as well as internal peer equity.

Oracle US offers a comprehensive benefits package which includes the following:
1. Medical dental and vision insurance including expert medical opinion
2. Short term disability and long term disability
3. Life insurance and AD&D
4. Supplemental life insurance (Employee/Spouse/Child)
5. Health care and dependent care Flexible Spending Accounts
6. Pre-tax commuter and parking benefits
7. 401(k) Savings and Investment Plan with company match
8. Paid time off: Flexible Vacation is provided to all eligible employees assigned to a salaried (non-overtime eligible) position. Accrued Vacation is provided to all other employees eligible for vacation benefits. For employees working at least 35 hours per week the vacation accrual rate is 13 days annually for the first three years of employment and 18 days annually for subsequent years of employment. Vacation accrual is prorated for employees working between 20 and 34 hours per week. Employees working fewer than 20 hours per week are not eligible for vacation.
9. 11 paid holidays
10. Paid sick leave: 72 hours of paid sick leave upon date of hire. Refreshes each calendar year. Unused balance will carry over each year up to a maximum cap of 112 hours.
11. Paid parental leave
12. Adoption assistance
13. Employee Stock Purchase Plan
14. Financial planning and group legal
15. Voluntary benefits including auto homeowner and pet insurance

The role will generally accept applications for at least three calendar days from the posting date or as long as the job remains posted.