IC Package Integration Engineer
IC Package Integration Engineer
Posted on :
02-08-2025
Employer Active
1 Vacancy
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Monthly Salary
USD 147400 - 272100
Vacancy
1 Vacancy
Posted on :
02-08-2025
Job Description
- Work with cross-functional teams and lead package integration and architecture efforts. - Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs 10% International travel. - Work to bring innovative packaging solutions from concept to mass production including package module and technology development.
- BS and 3 years of relevant industry experience.
- We are looking for someone with experience in Semiconductor Packaging Design Process & Technology Development
- Good understanding of cross-functional packaging areas: Si floor plan package layout and architecture enabling process technologies thermal mechanical SI/PI material component & system level reliability testing and FA
- Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor thermo-mechanical reliability and cost constraints
- Excellent problem solving with strong physics and fundamentals
- Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers
- Multi-functional coverage on package layout (Cadence APD/Allegro) critical signal integrity / power integrity thermal design rules BOM design for manufacturing reliability and cost
- Ability to work independently and take on projects with minimum supervision
- Ability to lead and manage teams
- Knowledge of Cellular packaging and systems a plus
Employment Type
Full Time
Key Skills
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