drjobs Semiconductor Packaging Engineering Intern - Fall 2025

Semiconductor Packaging Engineering Intern - Fall 2025

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Job Location drjobs

Austin - USA

Monthly Salary drjobs

Not Disclosed

drjobs

Salary Not Disclosed

Vacancy

1 Vacancy

Job Description

NXPs Technology (CTO) organization plays an essential role in the companys success by ensuring the delivery of high quality scalable cost-competitive technologies and supply to create a competitive advantage for our customers.

The Packaging Innovation (PI) organization in CTO is responsible for the implementation of packaging solutions for new product introduction and new technology development for electronic packages for the varied business product lines.

Job Summary:

  • Work with packaging engineers to help define and validate packages used for new products for NXP.
  • Potential working in the lab to perform tests and mechanical analysis to evaluate packages and materials used in microelectronic packages.
  • Potential working with the design team using CAD to define packages that will be used for new products.
  • Potential working with Package Innovation team modeling package performance (thermal mechanical electrical)
  • Address and solve design materials and processing issues that may occur during the development process.

Job Qualifications:

  • B.S M.S. or Ph.D. Candidate in Materials Science Mechanical Engineering or Electrical Engineering.
  • Ability to be a team player with positive attitude self-driven with good communication and presentation skills (both written and verbal).
  • Willingness to learn new concepts and apply fundamental knowledge to engineering problems.
  • Working knowledge of MS Office tools like PowerPoint Word Excel is required.
  • Working knowledge of CAD tools and/or Finite Element Simulation tools is a plus.
  • Working knowledge of various IC packages like QFP QFN BGA flip chip wafer level fan-in and fan-out is a plus.
  • Knowledge of Statistical Data Analysis incl. graphing/plotting and Design of Experiment is a plus.
  • Knowledge of soldering and intermetallic compounds is a plus.

In order to be considered for an internship with NXP you must be returning to school (or graduating) at the conclusion of the internship term. If you are graduating prior to Dec 2025 please apply for positions labeled Graduate Hire or Entry Level.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age color national origin race religion creed gender sex sexual orientation gender identity and/or expression marital status status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal state or local addition NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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Required Experience:

Intern

Employment Type

Full-Time

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