Advanced Package Design Engineer
Advanced Package Design Engineer
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Job Description
About Marvell
Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI automotive and carrier architectures our innovative technology is enabling new possibilities.
At Marvell you can affect the arc of individual lives lift the trajectory of entire industries and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation above and beyond fleeting trends Marvell is a place to thrive learn and lead.
Your Team Your Impact
The Marvell - Central Engineering Packaging organization drives semiconductor IC package development from concept to mass production and is responsible for supporting customers with advanced custom package designs that meet challenging electrical requirements. Many of the new designs are requiring multi-chip and multiple component configurations driving advanced technology requirements. There is the excitement of always working on new projects and cutting-edge technologies.What You Can Expect
Evaluating design feasibility based on given package topology design rules and electrical requirements.
Hands on physical implementation of the package design.
Close interaction with electrical simulation team to optimize the design to meet electrical requirements.
Close interaction with the operations team and fabrication suppliers to meet design for manufacturing requirements.
Other layout related tasks such as tool evaluations flow development libraries usage and maintenance.
What Were Looking For
Bachelors degree in Electrical Engineering with 3 - 5 years of related professional experience or Masters/PhD in Electrical Engineering with 1-3 years of experience.
Familiarity with IC package or PCB layout tools like Cadence APD Xpedition Package Designer.
Familiarity with packaging technologies materials package substrate design rules and assembly rules.
Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L (b) EMIB (c) CPO (d) CPC.
Hands-on design experience on flip chip packages 2.5D or 3D is a plus.
Familiar with interpreting electrical simulation results such as IR Drop reports and S-parameter data ability to run basic checks..
Good English (spoken and written).
Able to organize their work to meet specific milestones.
Able to work well in a team.
Additional Compensation and Benefit Elements
With competitive compensation and great benefits you will enjoy our workstyle within an environment of shared collaboration transparency and inclusivity. Were dedicated to giving our people the tools and resources they need to succeed in doing work that matters and to grow and develop with us. For additional information on what its like to work at Marvell visit our Careers page.
All qualified applicants will receive consideration for employment without regard to race color religion sex national origin sexual orientation gender identity disability or protected veteran status.
#LI-AB1Employment Type
Full-Time
