Department Intro:

The Technology Development (TD) department at Micron Technology is at the forefront of innovation driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of nextgeneration semiconductor products. By collaborating closely with our global R&D and manufacturing teams we ensure the efficient transfer and implementation of new technology nodes maintaining Microns leadership in the industry. Join us to be part of a dynamic and forwardthinking team that is molding the future of technology!

Position Overview:

As an Equipment Development Engineer in Microns Advanced Technology Packaging Development (APTD) team you will be responsible for developing and optimizing next generation second of a kind (SAOK) wafer and die equipment (Post probe wafer and die development) to improve capability efficiency and cost of such equipment. You will take ideas from conception through equipment and subcomponent development all the way to implementation in APTD and manufacturing facilities. You will also be required to identify diagnose and resolve equipment related problems by applying failure analysis FMEA 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes leading and participating in equipment maturity and availability improvement and cost reduction activities.

This position requires working in a highly collaborative atmosphere interacting with various groups such as process development manufacturing and equipment vendors to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer driving post probe wafer and assembly technology roadmaps which have a direct influence on Microns global leadership in semiconductor manufacturing.

Responsibilities:

• Develop strategies and execute to improve Equipment maturity for hardware.

• Developing wafer and assembly equipment to meet the physical and electrical requirements of Microns products.

• Optimizing equipment to reduce cost availability and improve hardware and process capability.

• Collaborate with process development teams to develop innovative new solutions.

• Conduct root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions.

• Perform fundamental research to drive innovative solutions for nextgeneration equipment products.

• Support equipment transfer to production facilities (some domestic or international travel may be required).

Minimum Qualifications:

• Bachelors Degree in Material science Mechanical Engineering Chemical Engineering Electrical Engineering Physics or related field

• 2 years of semiconductor process or equipment engineering experience

• Understand of design of experiment techniques (DOE) Statistical Process Control (SPC) Defect analysis and data analysis

• Strong analytical and creative problemsolving skills.

• Ability to resolve sophisticated issues through rootcause or modelbased problem solving.

• Ability to multitask and manage numerous projects simultaneously.

• 2 years of experience working with wafer / assembly tools and overlay systems.

Preferred Qualifications:

• Masters Degree in Materials Science Chemical Engineering Electrical Engineering Mechanical Engineering Physics or other related technical fields.

• Strong leadership skills with the shown ability to coordinate efforts across a variety of groups

• Ability to work independently with minimal direction and a focus on meeting commitments.