drjobs Advanced Package Technology Engineer

Advanced Package Technology Engineer

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1 Vacancy
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Job Location drjobs

Fort Collins, CO - USA

Monthly Salary drjobs

$ 119000 - 190000

Vacancy

1 Vacancy

Job Description

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Job Description:

As part of WW ASIC product development team this individual will work closely with silicon & package design marketing NPI assembly/substrate suppliers & customers and is responsible for developing cost effective high performance advanced custom package solutions achieving signal integrity thermal structural reliability substrate fab/package assembly design rules & project schedule requirements.
2.5D & 3D is cutting edge package technology with BRCMs needs pushing the technology limits.
Job Scope (Advanced Package Technology Engineer)
Provide deeper expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates consolidation of requirements and drive towards unified solution.
Lead in identification development & qualification; program management with external assembly partners
Lead in memory supplier(s) engagement to define technology and quality requirements.
Interface with other technical teams (DI Pkg Design Test Dev) etc. as part of Cross Functional Team.
Support new design wins NPI and volume ramps.
Develop alternate sourcing & qualification.
Basic: Masters Degree in Mechanical / Electrical / Electronics Engineering with 6 years of relevant experience in developing cost effective high performance (speed density pin count thermal & reliable) single & multichip large complex custom & fine pitch flip chip packaging solution with advanced multilayer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 10 years of relevant experience
Specific: 46 years Hands On experience in 2.5D / 3D Development; Indepth Knowhow of Advanced Silicon fab Bump Interposer substrate & assembly processes materials & supplier selection BOM definition thermal and mechanical interactions.
Others:
Sound knowledge of & hands on experience in advanced prevailing and emerging silicon package & substrate technologies bumping and assembly processes design rules failure analysis tools and techniques materials and equipment applicable industry standards regulations & quality systems.
Good team player with project management analytical problemsolving and interpersonal skills. Must be selfdriven flexible and agile result oriented individual. Ability to develop concepts into structured projects generate new and innovative solutions to complex problems and handle multiple programs concurrently.
Handson experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD AutoCAD Solidworks etc for design optimization.
Sound knowledge of advanced node silicon fabrication PCB technologies and board assembly processes applicable industry standards quality systems and regulations.
Communicate extensively with internal and external team members customers in various global locations and may require travel from time to time.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $119000 $190000

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical dental and vision plans 401(K) participation including company matching Employee Stock Purchase Program (ESPP) Employee Assistance Program (EAP) company paid holidays paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race color creed religion sex sexual orientation gender identity national origin citizenship disability status medical condition pregnancy protected veteran status or any other characteristic protected by federal state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA please be sure to fill out a home address as this will be used for future correspondence.

Employment Type

Full-Time

Company Industry

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