Principal IC Packaging Engineer Silicon Technology Starlink
Principal IC Packaging Engineer Silicon Technology Starlink
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Salary Not Disclosed
1 Vacancy
Job Description
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible with the ultimate goal ofenabling human life on Mars.
PRINCIPAL IC PACKAGING ENGINEER SILICON TECHNOLOGY (STARLINK)
SpaceX is leveraging its experience in building rockets and spacecraft to deploy Starlink the worlds most advanced broadband internet system. Starlink is the worlds largest satellite constellation and is providing fast reliable internet to 4M users worldwide. We design build test and operate all parts of the system thousands of satellites consumer receivers that allow users to connect within minutes of unboxing and the software that brings it all together. Weve only begun to scratch the surface of Starlinks potential global impact. As we continue to upgrade and expand the constellation were looking for bestinclass engineers to join the team.
In true SpaceX fashion Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly inhouse for development and manufacturing. We are looking for handson and dynamic engineers with expertise in advanced semiconductor packaging assembly design development equipment and testing. You will assume full ownership of packaging modules and products as we strive to make Starlink more affordable to those who need it most.
RESPONSIBILITIES:
- Own packaging assembly processes including material characterization and downselection for waferlevel and chiplevel systems
- Develop new technologies and establish baselines for assembly and packaging including SMT flip chip bonding molding underfill dispense EMI shielding lid and solder ball attach
- Bringup for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
- Own packaging prototypes product development and release to production
- Select equipment and material to meet quality reliability cost yield and production targets
- Interface with equipment and material suppliers including continuous improvement plans cost reduction and productivity improvements
- Crossfunctional interface with IC design materials thermal systems and production teams
- Implement advanced packaging solutions into SpaceX next generation products
BASIC QUALIFICATIONS:
- Bachelors degree in electrical engineering mechanical engineering chemical engineering materials science physics or other applied engineering discipline
- 10 years of professional experience in semiconductor assembly and packaging
PREFERRED SKILLS AND EXPERIENCE:
- Advanced technical degree
- 15 years industry experience with microelectronics packaging development
- Familiarity with 2D 2.5D and/or 3D packaging integration
- Packaging familiarity with flipchip BGA fcCSP WLCSP fan out FO processes systeminpackage SiP multichip modules MCM wirebond panel level packaging heterogenous and chiplet integration
- Handson packaging PCBA and SMT assembly experience
- OSAT (outsource semiconductor assembly and test) experience a plus
ITAR REQUIREMENTS:
- To conform to U.S. Government export regulations applicant must be a (i) U.S. citizen or national (ii) U.S. lawful permanent resident (aka green card holder) (iii) Refugee under 8 U.S.C. 1157 or (iv) Asylee under 8 U.S.C. 1158 or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit competence and qualifications and will not be influenced in any manner by race color religion gender national origin/ethnicity veteran status disability status age sexual orientation gender identity marital status mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceXs Affirmative Action Plan for veterans and individuals with disabilities or applicants requiring reasonable accommodation to the application/interview process should reach out to.
Required Experience:
Staff IC
Employment Type
Full Time
