Principal Architect - Novel Advanced Packaging Solutions for Systems Thermal Management
Principal Architect - Novel Advanced Packaging Solutions for Systems Thermal Management
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$ 146650 - 225850
1 Vacancy
Job Description
Description
We are seeking an experienced Principal Architect with 815 years of technical expertise in advanced packaging for semiconductor chips specifically focusing on embedding and integrating advanced thermal management solutions such as using silicon microchannels. This role is critical for enhancing the thermal performance of chips used in electronics computing and data center applications. The ideal candidate will possess a comprehensive understanding of the semiconductor packaging industry landscape including key players innovative technologies and future trends. A strong academic background in engineering or a related field is essential.
Responsibilities:
Architectural Expertise: Define and drive the architectural vision for advanced packaging solutions that incorporate silicon microchannels for enhanced thermal management ensuring alignment with business objectives and market needs.
Design and Development Strategy: Drive the development of innovative packaging strategies that integrate advanced thermal management solutions optimizing heat dissipation and reliability while maintaining performance.
CrossFunctional Collaboration: Work closely with crossdisciplinary teamsincluding microfluidics design & materials advanced packaging system architecture and manufacturingto ensure seamless integration of thermal management solutions into overall design solution.
Market Analysis and Strategy: Conduct thorough analyses of industry trends and emerging technologies related to thermal management to inform strategic direction and product development initiatives.
Research and Innovation: Drive research efforts into nextgeneration packaging and thermal management technologies using silicon microchannels fostering innovation to maintain competitive advantage in the market.
Technical Mentorship: Provide guidance and mentorship to engineering teams on best practices in advanced packaging design and thermal management implementation.
Stakeholder Engagement: Engage with external partners suppliers and industry groups to foster collaboration and drive advancements in packaging technologies that incorporate thermal management solutions.
Education & Experience:
Education: Bachelors degree in Electrical Engineering Materials Science or a related field. Masters degree or PhD preferred.
Experience: 815 years of relevant experience in semiconductor packaging with a focus on advanced techniques such as 2.5D/3D integration fanout packaging or systemonchip (SoC) solutions.
Technical Expertise:
Deep knowledge of advanced packaging technologies
Familiarity with industry standards and best practices in semiconductor manufacturing.
Strong analytical skills to assess performance metrics related to thermal management and drive improvements.
Industry Insight:
Comprehensive understanding of the semiconductor and advanced packaging ecosystem including key players suppliers and networks.
Knowledge of current competitive stateoftheart technologies and future directions in advanced packaging.
Preferred Qualifications:
Industry experience with chiplet integration and heterogeneous system design.
Relevant background in thermal management using silicon microchannels and thermal interface materials (TIMs) is plus.
Proven track record of successful project management in a technical environment.
Excellent communication skills to effectively present ideas and collaborate with stakeholders.
The base pay range for this role is $146650 to $225850 annually with additional opportunities for pay in the form of bonus and/or equity (applies to US candidates only). Pay varies by work location jobrelated knowledge skills and experience.
Benefits:
HP offers a comprehensive benefits package for this position including:
Health insurance
Dental insurance
Vision insurance
Long term/short term disability insurance
Employee assistance program
Flexible spending account
Life insurance
Generous time off policies including;
412 weeks fully paid parental leave based on tenure
11 paid holidays
Additional flexible paid vacation and sick leave US benefits overview
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time with or without notice subject to applicable law.
Job
EngineeringSchedule
Full timeShift
No shift premium (United States of America)Travel
Relocation
YesEqual Opportunity Employer (EEO)
HP Inc. provides equal employment opportunity to all employees and prospective employees without regard to race color religion sex national origin ancestry citizenship sexual orientation age disability or status as a protected veteran marital status familial status physical or mental disability medical condition pregnancy genetic predisposition or carrier status uniformed service status political affiliation or any other characteristic protected by applicable national federal state and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
If youd like more information about HPsEEO Policyor your EEO rights as an applicant under the law please click here:Equal Employment Opportunity is the LawEqual Employment Opportunity is the Law Supplement
Required Experience:
Staff IC
Employment Type
Full-Time
