Semiconductor Package Electrical Design Engineer

Lead semiconductor package design in collaboration with IC design engineers to optimize product cost and performance.
Lead the layout design of package substrates and printed circuit boards for reference designs for semiconductor products incorporating high-speed memory interfaces and high-speed serial communication circuits.
Investigate technology trends in semiconductor packages and printed circuit boards and propose and develop design technologies required for next-generation products.
Take on a leadership role within the design team as your experience grows.

Qualifications :

MUST
Ability to understand the Renesas Culture principles of Transparent Agile Global Innovative and Entrepreneurial and act in accordance with these values
At least three years of practical experience in semiconductor package design
At least three years of practical experience in high-speed or high-frequency electrical design

WANT
At least three years of practical experience in semiconductor package design at a semiconductor manufacturer
At least three years of experience using electromagnetic field simulation tools such as HFSS and Q3D
At least three years of experience using high-frequency circuit simulation tools such as ADS and HSPICE
At least three years of experience in electrical characterization using VNAs impedance analyzers or similar equipment or in EMC evaluation

Additional Information :

ルネサスはTo Make Our Lives Easier人々の暮らしをより豊かで快適にするというPurposeのもと組込み半導体ソリューションを提供するグローバル企業です世界30か国以上で活躍する21000人を超えるエンジニアや課題解決のプロフェッショナルとともに自動車産業インフラIoT分野における世界最先端のテクノロジー開発に携わりより安全で健康的で環境にやさしくスマートな未来の実現に貢献しています 

ルネサスではTAGIETransparentAgileGlobalInnovativeEntrepreneurialを企業文化の中核としていますTAGIEは私たちの働き方や成長のあり方そしてPurposeの実現に向けた取り組みを支える共通の価値観ですこの協調的な精神と挑戦するマインドセットが半導体技術を通じた産業の変革と世界中の人々の暮らしへの貢献を可能にしています 

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私たちとともに未来を創造する挑戦にぜひ参加しませんか皆さまからのご応募をお待ちしております 

Remote Work :

No

Employment Type :

Full-time