Lead Fab Technology Engineer, Surface Preparation and Integration

Entegris is seeking aLead Fab Technology EngineerforSurface Preparation and Integration (SPI)based inJapanto play a pivotal role in solving our customers most challenging problems andidentifyingnew opportunitiesin Selective Wet Etchand Cleanarea. This position will beat the forefront of customer adoption progression of existing and new products providing technical leadership during launches and commercialization effortsfor EntegrisSPIMaterial SolutionsBusiness Unit.

Responsibilities:

Technical Expertise:

• Act asatechnical expertin Selective Wet Etch and CleanforSurface Preparation and Integration(SPI)inAsia supporting business operations.

• Lead customer evaluations ensuring precise execution and alignment with customer buying motives presented professionally.

Revenue and Market Growth:

• Develop strategies to drive revenue and market share growth for EntegrisSPI Materialsolutions inAsia.

Technical Support and Collaboration:

• Provide the necessary technical and application support during customer qualifications.

• Partneringwithaccount managers in product presentations and technical discussions.

• Identify develop and prioritizecustomeropportunities using Entegris value selling process.

• Active engagement with key equipment OEMsforcustomer demo andcollaborationfornew business opportunities.

• InterfacewithBusiness UnitandR&Dteamsto ensure the product pipeline is strategically aligned with customer and industry needs

Customer Relationship Management:

• Maintain a database of customerWetprocessand Entegris products.

• Conduct regular customer reviews to understand ongoing needs and develop account management plans with account managers.

• Establish strong customer relationships to become the go-to technical resource forWet Etch and Cleanin the region.

Education and Training:

• Educate customers and colleagues on relevant processsolutionsknowledge.

Product Positioning and Life Cycle Management:

• Take responsibility for product positioning and life cycle management tomaintainmarket share.

Team Collaboration and Business Meetings:

• Participate in business review meetings with theSPIleadership team.

• Represent the region/platform in local and global opportunity reviews.

• Drive and advise on technical roadmap discussions with customers.

• Collaborate with functional teams such as account managers supplychainand quality to support customer requirements and operations.

Travel and Revenue Goals:

• Travel withinJapanand to other global locations as necessary to supportcustomer engagement(up to30% travel).

• Own and be accountable for the regionsSPIrevenue goal.

Qualifications:(Knowledge Skills and AbilitiesEducationExperience)

Education and Experience:

• Bachelors degree inchemistry/ chemicalengineeringmaterialscienceorengineeringwith10 years of experience inWet Etch and Cleanareain semiconductors processing orfabenvironment/ equipment supplier/ material supplier.

• Masters degreeor PhDs degreeinchemistry/ chemicalengineeringmaterialscienceorengineeringwith8 years of experience inWet Etch and Cleanareain semiconductors processing orfabenvironment/ equipment supplier/ material supplier.

Technical Skills:

• ExtensiveexperienceonWetEtchand Cleanprocessdevelopmentinadvancedwaferfabenvironment(AdvancedLogic or MemoryVertical/3Darchitecture)or a semiconductor equipment company is preferred.

• Analytical approach to problem solving; team player andworkswell under stress.

• Experienced inSurfaceAnalyticaltechniquesis a plus.

Location:Tokyo(or close-by areas)Japanspecific.

Additional Skills:

• Self-directed workethicwith minimal supervision.

• Strong teamplayer isrequired.

• Demonstrated ability to develop and present technical presentations.

• Strong verbal and written communication skills for both internal and external audiences.

• English-speaking and presentation skill (TOEIC > 600 preferred)

• Sales or management experience isa plus.