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RFIC Packaging (Mechanical) Engineer
Job Location:
Monthly Salary:
Posted:
22 August 2026 (Yesterday)
Posted:
Application Deadline:
19 November 2026
Application Deadline:
Vacancies:
1 Vacancy
Vacancies:
Job Summary
MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets including Data Centers Telecommunications Industrial and Aerospace and Defense. We develop innovative cutting-edge technologies and products across the spectrum of radio frequency (RF) microwave millimeter wave photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence high performance computing satellite communications radar unmanned aerial vehicles medical equipment test and measurement and advanced wireless networks.
MACOM has more than 75 years of expertise in semiconductor process development wafer fabrication circuit design advanced packaging systems architecture and applications engineering. We are committed to our customers success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power highest frequency and/or highest data rates.
Leading technologies innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!
Job Purpose
Project Manager and Technical lead for MMIC (GaAs GaN Si SOI) package development and volume production manufacturing supporting new product introductions from concept through production release. This individual will provide direction to product and design engineers for optimum cost-effective packaging solutions including thermal and mechanical design/analysis. Package types include overmolded leadframe-based packages laminate packages ceramic packages and metal packages for RF and Microwave assemblies. This individual may be required to manage/lead multiple new product packaging development programs in parallel to delivering packaging solutions on schedule for high volume high mix manufacturing.
Main Duties and Responsibilities
Major Project Technical lead for developing RF and Microwave packaging solutions.
Work with internal Product Design QA Reliability Supply chain and external suppliers to develop apply and qualify the appropriate packaging technologies and assembly processes with focus on cost high volume manufacturability yield and quality.
Work with Design Engineering Program Management and Material Planning to plan and establish Engineering Build Requirements and Qualification Build Requirements for new product introductions.
Work with vendors and internal engineering resources to establish and update design rules for packaging.
Team-lead in performing packaging design reviews to ensure adherence to Design-for-Manufacture guidelines.
Contribute to establishing and implementing robust assembly processes internally and at contract manufacturers.
Provide supplier benchmarking and tracking data to drive backend technology roadmaps.
Working with Quality organization characterize failure modes and analyze as a function of packaging materials and processes. Troubleshoot packaging and assembly defects then define and implement corrective actions.
Team-lead in Design/Development of tooling for high volume high mix processes.
Team-lead in establishing application notes for new packages.
Key Competencies Required
MS 6 or BS 8 years of experience in Materials Science EE or ME with advanced IC package process development and design with emphasis on RF and Microwave assemblies.
Comprehensive knowledge of high-volume RFIC and Microwave IC assembly processes (die attach flip chip wafer saw wire bond surface mount package singulation molding etc.)
Proven track record of successfully driving package design/development/characterization activities from concept to implementation. Strong understanding of relationship between materials and package performance.
Demonstrated ability to lead independent process development efforts and provide suppliers direction by working with design assembly and quality organizations
Experience in working with high volume and mixed volume manufacturing operations around the globe.
Comprehensive knowledge of product characterization testing quality and reliability including compliance testing and certification JEDEC IPC EIA RoHS WEEE Mil-Standards
Experience in process troubleshooting failure analysis and Six Sigma methodologies (Process mapping C&E PFMEA DOE SPC)
Ability to lead projects under tight deadlines with strong ownership of projects
Ability to work effectively in a multi-project mode
Good written and verbal communication skills. Able to present ideas design concepts data and plans with high confidence at team meetings and business group review meetings
Good teamwork skills in working together to achieve goals
Experience with AutoCAD and/or Solidworks is required
Experience with solving steady state and dynamic thermal and mechanical problems using finite element analysis (FEA) is a plus
Experience using Minitab or Jump is a plus
Fluent with Microsoft Office products.
International travel required
Fluency in spoken and written English
MACOM has more than 75 years of expertise in semiconductor process development wafer fabrication circuit design advanced packaging systems architecture and applications engineering. We are committed to our customers success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power highest frequency and/or highest data rates.
Leading technologies innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!
Job Purpose
Project Manager and Technical lead for MMIC (GaAs GaN Si SOI) package development and volume production manufacturing supporting new product introductions from concept through production release. This individual will provide direction to product and design engineers for optimum cost-effective packaging solutions including thermal and mechanical design/analysis. Package types include overmolded leadframe-based packages laminate packages ceramic packages and metal packages for RF and Microwave assemblies. This individual may be required to manage/lead multiple new product packaging development programs in parallel to delivering packaging solutions on schedule for high volume high mix manufacturing.
Main Duties and Responsibilities
Major Project Technical lead for developing RF and Microwave packaging solutions.
Work with internal Product Design QA Reliability Supply chain and external suppliers to develop apply and qualify the appropriate packaging technologies and assembly processes with focus on cost high volume manufacturability yield and quality.
Work with Design Engineering Program Management and Material Planning to plan and establish Engineering Build Requirements and Qualification Build Requirements for new product introductions.
Work with vendors and internal engineering resources to establish and update design rules for packaging.
Team-lead in performing packaging design reviews to ensure adherence to Design-for-Manufacture guidelines.
Contribute to establishing and implementing robust assembly processes internally and at contract manufacturers.
Provide supplier benchmarking and tracking data to drive backend technology roadmaps.
Working with Quality organization characterize failure modes and analyze as a function of packaging materials and processes. Troubleshoot packaging and assembly defects then define and implement corrective actions.
Team-lead in Design/Development of tooling for high volume high mix processes.
Team-lead in establishing application notes for new packages.
Key Competencies Required
MS 6 or BS 8 years of experience in Materials Science EE or ME with advanced IC package process development and design with emphasis on RF and Microwave assemblies.
Comprehensive knowledge of high-volume RFIC and Microwave IC assembly processes (die attach flip chip wafer saw wire bond surface mount package singulation molding etc.)
Proven track record of successfully driving package design/development/characterization activities from concept to implementation. Strong understanding of relationship between materials and package performance.
Demonstrated ability to lead independent process development efforts and provide suppliers direction by working with design assembly and quality organizations
Experience in working with high volume and mixed volume manufacturing operations around the globe.
Comprehensive knowledge of product characterization testing quality and reliability including compliance testing and certification JEDEC IPC EIA RoHS WEEE Mil-Standards
Experience in process troubleshooting failure analysis and Six Sigma methodologies (Process mapping C&E PFMEA DOE SPC)
Ability to lead projects under tight deadlines with strong ownership of projects
Ability to work effectively in a multi-project mode
Good written and verbal communication skills. Able to present ideas design concepts data and plans with high confidence at team meetings and business group review meetings
Good teamwork skills in working together to achieve goals
Experience with AutoCAD and/or Solidworks is required
Experience with solving steady state and dynamic thermal and mechanical problems using finite element analysis (FEA) is a plus
Experience using Minitab or Jump is a plus
Fluent with Microsoft Office products.
International travel required
Fluency in spoken and written English
Required Experience:
IC
About Company
MACOM designs and manufactures high-performance semiconductor products for the Telecommunications, Industrial and Defense, and Data Center industries.
