Principal Process Engineer — Advanced Semiconductor Device Development

For over three decades breakthrough advances in computing and intelligent systems have been driven by innovation at the intersection of physics materials manufacturing and engineering. The next generation of high-performance technologies will require entirely new approaches to semiconductor processing integration and scalable device fabrication.

We are looking for a Senior Process Engineer to help develop advanced semiconductor device technologies from early research through process integration and pilot manufacturing. This role combines hands-on cleanroom work process development external partner coordination and deep technical problem solving across complex wafer fabrication flows.

You will work closely with multidisciplinary R&D teams to enable next-generation device platforms through advanced process engineering and integration.

What youll be doing:

• Develop and optimize semiconductor wafer fabrication processes across multiple process modules.
• Drive process integration from incoming wafer through fully processed devices.
• Work hands-on in the cleanroom across lithography dry etch wet etch dielectric deposition implantation metallization and wafer handling processes.
• Develop and qualify advanced substrate preparation thinning bonding and backside processing flows.
• Define process characterization strategies including CD control overlay budgets metrology and defect inspection.
• Partner with external vendors and manufacturing partners to support complex multi-site wafer flows.
• Drive DOE learning cycles root-cause investigations yield analysis and process optimization.
• Collaborate with device characterization packaging and reliability teams to correlate process behavior with device performance.
• Build scalable process documentation travelers specifications and process-control methodologies.
• Support transfer of development processes into pilot manufacturing environments.

Qualifications :

What we need to see:

• BS MS or PhD in Materials Science Physics Electrical Engineering Chemical Engineering or related field.
• 5 years of semiconductor process development experience.
• Strong hands-on cleanroom experience across multiple semiconductor processing modules.
• Experience with compound semiconductor or advanced device processing preferred.
• Understanding of lithography etch dielectric deposition implantation metallization and process integration.
• Experience working with process characterization SPC DOE and failure analysis methodologies.
• Strong experimental problem-solving and debugging skills.
• Ability to work effectively across multidisciplinary engineering teams.

Ways to stand out from the crowd:

• Experience developing advanced or non-standard semiconductor process flows.
• Experience with wafer bonding substrate removal or heterogeneous integration.
• Strong process integration mindset with broad cross-module understanding.
• Experience building scalable process infrastructure in R&D environments.
• Familiarity with advanced metrology and defect characterization techniques.
• Demonstrated ability to rapidly iterate and solve complex process problems.

Additional Information :

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Remote Work :

No

Employment Type :

Full-time