Process Integration Device Engineer

NXP Semiconductors


Job Location:

Shanghai - China

Monthly Salary: Not Disclosed
Posted on: Yesterday
Vacancies: 1 Vacancy

Job Summary

Responsibilities:

Role Purpose
Lead the development integration and transfer of HV/BCD semiconductor technologies serving as the key technical interface between NXP and external foundries in China. This role ensures that process integration device performance and reliability fully meet NXP product and business requirements through strong device physics expertise and cross-functional leadership.

Process Integration & Technology Transfer

  • Act as a Process Integration / Device Engineer in HV and BCD technology development and transfer projects.

  • Ensure external foundries correctly understand and implement NXP technology and device requirements.

  • Define and communicate technical specifications; review foundry implementations and assess alignment with NXP needs.

  • Analyze process integration deviations and their impact on performance yield and reliability.

  • Propose and drive corrective solutions to align foundry implementations with NXP standards.

Device & Physics Leadership

  • Lead or strongly contribute to HV/BCD device architecture development and optimization (LDMOS EDMOS ESD).

  • Analyze key device physics parameters including breakdown voltage (BV) Rdson SOA and reliability.

  • Utilize TCAD (2D/3D) simulations to accelerate development cycles and root-cause analysis.

  • Support device verification through statistical analysis of DOE and WAT data.

Cross-functional & External Collaboration

  • Collaborate closely with internal Business Design Design Enablement PI and PE teams.

  • Serve as the primary technical interface to foundries in China leading technical discussions and decision-making.

  • Drive projects to timely completion in support of NXP business and product roadmaps.

Requirements:

Required Qualifications

  • Masters or Ph.D. in Electrical Engineering Solid-State Physics or Materials Science.

  • 10 years of semiconductor industry experience in process integration or device engineering.

  • Profound knowledge of HV and BCD technologies.

  • Strong experience in technology development and/or transfer projects with foundries.

  • Hands-on experience with TCAD tools (Sentaurus / Silvaco); familiarity with JMP and Cadence is a plus.

  • Fluent in English with the ability to communicate technical concepts clearly; Mandarin proficiency required.

Competencies

  • Technical Ownership: Strong accountability for technical quality robustness and project outcomes.

  • Critical Thinking: Ability to diagnose complex process and device issues using data-driven methods.

  • Collaboration: Effective communicator across multicultural cross-functional and external teams.

  • Decision Making: Balances device physics process integration and business needs in technical decisions.


More information about NXP in Greater China...

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Required Experience:

IC

Responsibilities:Role PurposeLead the development integration and transfer of HV/BCD semiconductor technologies serving as the key technical interface between NXP and external foundries in China. This role ensures that process integration device performance and reliability fully meet NXP product and...

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