Supporting comprehensive design reviews and documentation.
Incorporate changes required from supplier notices or feedback from DFM reviews along with any outstanding TQs.
Get technical questions and follow ups out to engineering within 24 hours.
Post processing of all output generation of release documentation for production.
Generate water marked Gerber files for supplier DFM reviews.
Upon job assignment maintain daily/weekly work logs recurring engineer meetings end of day job posts and project archiving.
Follow written processes and procedures for meeting company design requirements.
Able to work well individually or with teams supporting internal customer needs.
Meet the agreed deadlines for projects and/or design tasks.
Education & Experience
C.I.D. certification preferred.
Experience using Microsoft Office Suite.
Good oral and written communications skills.
Bachelors degree in Electronic Design or equivalent formal training preferred.
Working experience of IPC design standards and specifications required.
Drafting and documentation requirements for printed boards with ASME Y14.5 standards.
5 years experience and proficient in Cadence Expedition PADs Layout PADs Logic and CAM350 required. Experience with Downstream BluePrint for creating documentation a plus.
Skills
Expertise in Co-planar wave guides.
Experience with Multi-Layer Flex circuit designs required.
Experience with single ended impedance-controlled signal routing.
Expertise in high-speed differential and single ended impedance-controlled signal routing.
Expertise in HDI design transmission lines microstrip and strip line routing.
Experience with chip-on-board (COB) chip-on-flex (COF) and Flip Chip Technology.
Experience with BGA technology 0.35mm pitch and smaller.
Understanding of stubs reflections crosstalk and ground bounce (or switching noise).
Experience with microwave interconnecting signal paths at 10 GB/s data rates & higher.
5 years experience and proficient in Expedition PADs Layout PADs Logic and CAM350 required. Experience with Downstream BluePrint for creating documentation a plus.
Working Conditions
This role is 100% onsite
CultureCommitment
Ensure adherence to companys values (ICARE) in all aspects of your position at Coherent Corp.:
Integrity Create an Environment of Trust
Collaboration Innovate Through the Sharing of Ideas
Accountability Own the Process and the Outcome
Respect Recognize the Value in Everyone
Enthusiasm Find a Sense of Purpose in Work
Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex gender identity sexual orientation race color religion national origin disability protected Veteran status age or any other characteristic protected by law.
Required Experience:
IC
DescriptionPrimary Duties & ResponsibilitiesCreate new rigid flex & rigid/flex multilayer printed wiring board designs.Edit and revise existing rigid flex & rigid/flex multilayer printed wiring board designs.Supporting comprehensive design reviews and documentation.Incorporate changes required from ...
Supporting comprehensive design reviews and documentation.
Incorporate changes required from supplier notices or feedback from DFM reviews along with any outstanding TQs.
Get technical questions and follow ups out to engineering within 24 hours.
Post processing of all output generation of release documentation for production.
Generate water marked Gerber files for supplier DFM reviews.
Upon job assignment maintain daily/weekly work logs recurring engineer meetings end of day job posts and project archiving.
Follow written processes and procedures for meeting company design requirements.
Able to work well individually or with teams supporting internal customer needs.
Meet the agreed deadlines for projects and/or design tasks.
Education & Experience
C.I.D. certification preferred.
Experience using Microsoft Office Suite.
Good oral and written communications skills.
Bachelors degree in Electronic Design or equivalent formal training preferred.
Working experience of IPC design standards and specifications required.
Drafting and documentation requirements for printed boards with ASME Y14.5 standards.
5 years experience and proficient in Cadence Expedition PADs Layout PADs Logic and CAM350 required. Experience with Downstream BluePrint for creating documentation a plus.
Skills
Expertise in Co-planar wave guides.
Experience with Multi-Layer Flex circuit designs required.
Experience with single ended impedance-controlled signal routing.
Expertise in high-speed differential and single ended impedance-controlled signal routing.
Expertise in HDI design transmission lines microstrip and strip line routing.
Experience with chip-on-board (COB) chip-on-flex (COF) and Flip Chip Technology.
Experience with BGA technology 0.35mm pitch and smaller.
Understanding of stubs reflections crosstalk and ground bounce (or switching noise).
Experience with microwave interconnecting signal paths at 10 GB/s data rates & higher.
5 years experience and proficient in Expedition PADs Layout PADs Logic and CAM350 required. Experience with Downstream BluePrint for creating documentation a plus.
Working Conditions
This role is 100% onsite
CultureCommitment
Ensure adherence to companys values (ICARE) in all aspects of your position at Coherent Corp.:
Integrity Create an Environment of Trust
Collaboration Innovate Through the Sharing of Ideas
Accountability Own the Process and the Outcome
Respect Recognize the Value in Everyone
Enthusiasm Find a Sense of Purpose in Work
Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex gender identity sexual orientation race color religion national origin disability protected Veteran status age or any other characteristic protected by law.
Coherent is a global leader in lasers, engineered materials and networking components. We are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor
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