Director, Assembly Operations

We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable scalable manufacturing execution that achieves production output customer commit dates and revenue targets. The scope includes AI/data center infrastructure power packaging applications especially Smart Power Stages Vertical Power Stages Power Modules and Discrete FET packages with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN DBC and AMB substrates and advanced interconnect technologies. This leader will oversee assembly line readiness manufacturing execution capacity utilization cycle time yield performance quality control process change management and ramp readiness while partnering closely with Package Engineering Product Engineering Quality Supply Chain Management Planning Procurement and external OSAT partners.

The ideal candidate combines deep semiconductor assembly operations expertise with strong manufacturing leadership data-driven execution and cross-functional collaboration skills to drive factory performance product quality delivery reliability and continuous improvement across global operations. This role also serves as a critical interface to Package Engineering and Supply Chain Management by ensuring package development intent qualification requirements equipment capacity plans material readiness bill of material readiness and production ramp requirements are translated into stable cost-competitive high-volume assembly output.

Key Responsibilities:

Semiconductor Assembly Operations Leadership

• Lead semiconductor package assembly operations across global product lines and manufacturing partners.
• Drive daily weekly and quarterly execution to achieve production output customer delivery commitments and revenue targets.
• Manage assembly capacity throughput cycle time yield labor utilization equipment utilization and operational cost performance.
• Establish operating mechanisms for production reviews bottleneck resolution escalation management and factory performance tracking.
• Partner with Package Engineering Product Engineering Quality Supply Chain Management Planning Procurement and OSAT teams to ensure manufacturable designs qualified processes and robust production controls.

Production Output Yield & Continuous Improvement

• Own assembly output performance yield monitoring trend analysis and corrective action processes.
• Lead data-driven improvement initiatives to increase line output reduce bottlenecks improve first-pass yield and shorten cycle time.
• Resolve process equipment material reliability and customer quality issues through disciplined root-cause analysis.
• Define KPIs and dashboards to track production output revenue-supporting shipments manufacturing performance and operational effectiveness.

Quality & Reliability Management

• Partner with Quality and Reliability teams to meet internal industry and customer standards.
• Drive containment corrective and preventive actions for manufacturing and field quality issues.
• Ensure process controls and qualification requirements are maintained across OSAT sites.
• Support customer supplier and internal quality audits and reviews.
• Work with manufacturing partners to resolve issues early and ensure shipment of qualified products.

Process Change Management

• Lead process change management for materials equipment tooling flows and sites.
• Assess engineering changes for technical quality reliability supply and operational impact.
• Lead qualification plans for transfers second sourcing equipment changes and cost reductions.
• Maintain disciplined documentation change control and manufacturing readiness processes.

NPI Ramp Readiness & High-Volume Manufacturing Execution

• Serve as the key assembly operations interface for NPI-to-production transfers and high-volume ramp execution.
• Partner with Supply Chain Management Planning Procurement Package Engineering Product Engineering Quality and OSAT partners to establish NPI ramp readiness plans.
• Drive equipment capacity planning bottleneck analysis tooling readiness labor readiness and production line loading plans to support committed ramp schedules.
• Ensure bill of material readiness qualified material availability second-source plans supplier delivery alignment and material risk mitigation before production ramp.
• Lead manufacturing readiness process optimization capacity release and structured ramp execution for new products.
• Ensure process qualification material site equipment capacity and production control readiness for high-volume ramp.

OSAT Operations & Supply Chain Partner Management

• Manage global OSAT and contract manufacturing relationships supporting development ramp and production output.
• Drive partner accountability for production output yield quality cycle time reliability capacity and shipment execution.
• Lead operational reviews technical reviews audits benchmarking and qualification assessments for manufacturing partners.
• Collaborate with Supply Chain Management suppliers and OSAT partners on capacity expansion material readiness transfers optimization scaling and cost improvement.

Team Leadership & Organizational Development

• Build and develop a high-performing global assembly engineering team.
• Foster a culture of accountability collaboration technical excellence and continuous improvement.
• Support organizational scaling to meet evolving business and technology needs.
• Drive talent development succession planning and technical capability growth.
• Strengthen organizational expertise in packaging innovation to support business growth and customer adoption.

Qualifications :

Required Qualifications:

• Bachelors degree in Electrical Engineering Materials Science Mechanical Engineering Industrial Engineering Operations Management Supply Chain or related technical discipline.
• 12 years of semiconductor manufacturing packaging or assembly operations experience with significant exposure to IC assembly operations production ramp capacity planning package qualification and NPI-to-HVM transfers.
• 5 years of leadership experience managing manufacturing operations engineering or cross-functional teams in semiconductor manufacturing environments.
• Strong expertise in semiconductor package assembly processes including wirebond flip chip wafer-level packaging multi-chip modules molding singulation SMT and advanced packaging technologies; experience with power packaging power SiP/modules Smart Power Stages Vertical Power Stages Power Modules Discrete FET packages power devices and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC AMB and advanced interconnect technologies is a strong plus.
• Deep understanding of semiconductor manufacturing yield analysis SPC DOE reliability process control methodologies package/process qualification methods and statistical analysis tools.
• Experience working with global OSAT partners and outsourced manufacturing ecosystems including benchmarking selection qualification and ongoing technical management of subcontractors and contract manufacturers.
• Proven track record of successful NPI-to-HVM product ramp execution including equipment capacity planning material readiness bill of material readiness and production output delivery.
• Demonstrated ability to partner with Supply Chain Management Planning Procurement and OSAT partners to align capacity materials schedules and shipment execution to business revenue targets.
• Strong knowledge of semiconductor quality systems change management and qualification methodologies.
• Excellent analytical organizational communication and cross-functional leadership skills.

Preferred Qualifications:

• Masters degree or PhD in Engineering or related field.
• Experience with advanced packaging technologies such as 2.5D/3D packaging SiP fan-out embedded die heterogeneous integration wafer-level packaging multi-chip modules advanced interconnects and substrate technologies such as DBC and AMB.
• Familiarity with automotive AI/data center infrastructure power high-performance computing power semiconductor and wide-bandgap product manufacturing requirements.
• Experience managing geographically distributed engineering teams and global manufacturing operations.
• Knowledge of reliability standards including JEDEC IPC and customer qualification requirements.

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. As the industrys leading expert in embedded processing with unmatched quality and system-level know-how we have evolved to provide scalable and comprehensive semiconductor solutions for automotive industrial infrastructure and IoT industries based on the broadest product portfolio including High Performance Computing Embedded Processing Analog & Connectivity and Power.
 
With a diverse team of over 21000 professionals in more than 30 countries we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable power-efficient solutions today that help people and communities thrive tomorrow To Make Our Lives Easier.     
 
At Renesas you can: 

• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.  

• Make a real impact by developing innovative products and solutions to meet our global customers evolving needs and help make peoples lives easier safe and secure. 

• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system including the remote work option and Employee Resource Groups will help you excel from the first day.    

Are you ready to own your success and make your mark  

Join Renesas. Lets Shape the Future together.  

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Remote Work :

No

Employment Type :

Full-time