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RF Module Engineer
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RF Module Engineer
Cays Inc
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RF Module Engineer

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1 Vacancy
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Job Location

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- USA

Monthly Salary

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Not Disclosed

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Salary Not Disclosed

Vacancy

1 Vacancy

Job Description

Req ID : 2564017

Responsibilities:

  • Own endtoend RF module/SIP development for AR/VR products from concept to mass production.
  • Responsible for module/SIP technology selection part selection vendor evaluation contract development and performing cost/technology/performance analysis.
  • Develop module architecture schematics and layouts and work with vendors for DFM and manufacturing.
  • Perform simulation (RF circuit simulation 3D EM simulation and thermal simulation) factory bring up lab bench debug performance tuning and optimization and validation of RF modules/SIPs.
  • Design simulate and validate advanced RF packaging/module/SIP
  • Collaborate closely with crossfunctional teams and vendors to ensure RF performance is met at component board and system levels.
  • Evaluate new advanced packaging technology including design and validation of prototypes.
  • Domestic/international travel to achieve program milestones.
  • Minimum Qualification:

  • 3 years of experience in developing RF modules/SIPs preferable in wireless consumer electronics or similar industries.
  • At least BSEE or BSc in related engineering discipline
  • Experience with advanced packaging technologies and RF module/SIP design
  • Experience in RF schematics layouts and DFM.
  • Work experience with RF lab equipment for device characterization debug and component/system performance validation.
  • Experience using circuit EM and thermal simulation tools such as Ansys HFSS Keysight ADS/Momentum Cadence Allegro Cadence Virtuoso Ansys Icepak Flotherm.
  • Experience with developing RF test specifications and conducting RF lab testing with bench equipment (e.g. network analyzers communication testers spectrum analyzers and oscilloscopes)
  • Good communicator and team player.
  • Preferred Qualification:

    • MS or PhD in EE with emphasis on advanced packaging or RF design
    • 5 years of relevant industry experience
    • Experience in RF design and RF advanced packaging technologies.
    • Experience with WiFi BT GPS and cellular RF implementation.
    • Experience in bringing RF modules/SIPs to production
    • Familiar with regulatory requirements (FCC CE etc.).

    Employment Type

    Full Time

    Key Skills

    • Electrical Engineering
    • System Design
    • C/C++
    • Computer Networking
    • LabView
    • PCB
    • 5G
    • Sensors
    • Signal Processing
    • 3G
    • Matlab
    • 4G/LTE

    About Company

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