Principal Package Design Engineer – R&D (Discrete Power)

We are looking for a Principal Package Design Engineer to support new semiconductor package development and continuous design improvement primarily focusing on discrete packages. This role plays a key part in New Product Introduction (NPI) as well as mass production ensuring robust manufacturable and cost-effective package designs. You will collaborate closely with package architects and cross-functional engineering teams to deliver high-quality assembly designs aligned with industry and internal standards.

What You Will Do

• Lead and support lead frame package design for NPI and mass production phases ensuring alignment with functional and manufacturing requirements

• Work closely with Package Architects to develop technical assembly drawings

• Define and finalize dimensions and tolerances based on assembly capability package technology and lead frame fabrication design rules

• Ensure compliance with industry standards such as JEDEC and AEC-Q100/Q101 (automotive) as well as internal design guidelines

• Apply solid understanding of semiconductor assembly processes including die attach wire bonding (gold/copper/silver) and molding/encapsulation

• Understand lead frame materials and surface finishing/plating techniques (e.g. Ag NiPdAu Sn) to ensure reliability and solderability

• Support evaluation of high-precision metal manufacturing processes such as progressive die stamping and chemical etching

• Identify cost reduction opportunities and drive initiatives to improve package competitiveness

• Perform statistical analysis failure analysis and structured problem-solving to support technical decisions and reporting

• Contribute to technical paper writing and intellectual property (IP) generation

What You Will Need

• Bachelors or masters degree in mechanical Electronics Manufacturing Engineering or related discipline

• Minimum 6 years of experience in lead frame design semiconductor packaging design or related fields

• Strong knowledge of semiconductor assembly processes and packaging technologies

• Experience with lead frame materials plating technologies and manufacturing processes

• Proficiency in AutoCAD and SolidWorks is essential

• Familiarity with statistical tools and methodologies such as Minitab DOE FMEA and technical reporting

• Strong communication skills both verbal and written with fluent English.

• Good understanding of structured engineering reporting and documentation practices

• Ability to work independently and as part of a cross-functional team

• Self-motivated adaptable and willing to take ownership of tasks and challenges

• Fast learner with strong teamwork mindset

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all and we consider all applicants fairly as well as providing a safe work environment and reasonable adjustments where requested.

In addition we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Womens groups. Nexperia is committed to increasing women in management positions to 30% by 2030.