Senior Hybrid Integration Engineer (mfd)
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Posted on:
4 hours ago
Vacancies:
1 Vacancy
Job Summary
Your mission
Turning breakthrough technology into real products requires more than invention. It requires the precision to connect worlds that rarely meet: photonics electronics and advanced packaging working as one. Hybrid integration is where that convergence happens.
As our Senior Hybrid Integration Engineer (m/f/d) your mission is to drive the integration of photodiodes and lasers into photonic integrated circuits (PICs) from first concept through full validation. You will support fully packaged PICs with integrated components and contribute directly to shaping technology roadmap. Through hands-on system bring-up cross-functional collaboration and close work with external partners you translate cutting-edge opto-electronic designs into functioning characterized assemblies that meet performance targets.
Your profile
- Lead photodiode and laser integration projects on PICs across the full workflow: design build characterization and validation.
- Perform hands-on PIC testing optical alignment and system bring-up including signal readout and performance evaluation.
- Collaborate with photonics electronics and packaging teams; coordinate suppliers service providers and research partners.
- Ensure configuration control of process flows and maintain clear decision and action logs.
- Introduce automation strategies for characterization and propose new process trials based on results.
- Optimize integration yield and throughput; track KPIs including assembly yield responsivity TIA SNR bandwidth schedule adherence cost per channel and risks mitigated
- Ph.D. in Electrical Engineering Photonics or a closely related field or a Masters degree with at least 3 years of directly relevant industry or research experience.
- Deep technical understanding of photodiode and laser physics TIA and driver design and characterization and hybrid integration approaches.
- Proven hands-on experience with PIC testing optical alignment and system bring-up in a lab or production environment.
- Familiarity with photonic integration platforms such as LNOI InP or SiPh is a strong plus.
- Ability to balance complex electrical and optical trade-offs (responsivity bandwidth noise) and make well-reasoned design decisions independently.
- Fluent in English German is a plus.
Why us
We hire for attitude and train for skills.
We encourage self responsibility and accelerate professional development.
We move fast and encourage experimentation.
You have the opportunity to be part of developing breakthrough photonic computing technology and have a lasting impact on the future of computing.
You can be part of a passionate international highly skilled cross functional team.
You will have access to the founders of the company.
About us
Who we are and what we do
is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS operates its own pilot line for photonic chips based on the material system Thin-Film Lithium Niobate TFLN. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart Germany.Required Experience:
Senior IC
About Company
Who we are and what we do Q.ANT is a photonic technology scale-up that emerged from TRUMPF’s R&D labs with deep knowledge in light generation, processing and detection. Since its founding as an independent startup in 2018, the company has been advancing and industrializing photonic an ... View more
