Principal Solutions Engineer Allegro Package Designer

At Cadence we hire and develop leaders and innovators who want to make an impact on the world of technology.

Cadence Design Systems Inc. is looking for a motivated Principal Solutions Engineer: Allegro Package Designer to work with us in Belo Horizonte Brazil for the Allegro Team. Cadence has been nominated as a Great Place to Work globally and in Brazil and is also a Fortune 100 Best Companies to Work For.

This position involves delivering advanced packaging and 3DIC implementation flows for foundry and customer solutions primarily using Cadence Allegro Package Designer (APD).

Job Description:

• Work in a team environment creating and implementing 3DIC reference flows and designs.
• Use Allegro Package Designer (APD) with experience routing laminates and RDL designs coding technology files creating rules and constraints handling Ravel coding for 3D rules and implementing bond wires bumps and 3D structures and designs.
• Use Allegro SKILL for scripting and automation.
• Experience with creating Virtuoso-ready APD package files a must.
• Expertise with packaging formats including GDS Gerber IPC and DXF both for import and export.

Requirements:

• Complete Bachelors degree in Electrical or Electronics Engineering
• Experience with package design and APD
• Strong knowledge of advanced packaging concepts
• Strong knowledge of 2.5D 3DIC and stacked die technologies
• Good programming knowledge with Allegro Skill and Ravel a plus
• Strong customer-facing communication and problem-solving skills
• Strong personal drive for continuous learning and expanding professional skill sets
• Excellent verbal and written communication skills

Additional Job Details:

• Employment category: CLT.

• Employment term: 40 hours/week.

• Competitive benefits.

• Location: Av Contorno 5800 Belo Horizonte Minas Gerais Brazil.

Cadence is the only company that provides the expertise and tools IP and hardware required for the entire electronics design chain from chip design to chip packaging to boards and to systems. We enable electronic systems and semiconductor companies to create innovative products that transform the way people live work and play. Our products are used in mobile consumer cloud datacenter automotive aerospace IoT industrial and other market segments.

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