Senior Structural Modeling & Simulation Engineer

Description -

Senior Structural Modeling & Simulation Engineer

At HP we exist to amazethrough the people we hire the experiences we enable and ultimately the technology we create. We invent develop and bring to market new technologies and capabilities and integrate them into our products. The R&D initiatives in our state-of-the-art microfluidics and MEMS lab are based on HPs long history in print where we pursue adjacent technologies with an eye toward consumer and industrial applications. Applications include life science industrial print precision dispense next-gen thermal control and more. We provide advanced innovative solutions to our partners and customers both internal and external.

Responsibilities:

As an EMAG (Engineering Modeling and Analysis Group) Senior Structural Modeling Engineer you will work as an integral part of the broader team. You will lead simulation-first design efforts across the organization by developing and running simulation models to uncover fundamental insights and expedite design cycles. EMAG is responsible for the development of predictive and diagnostic computational modeling methods in new technology and product development.

Required Skills:

• M.S./Ph.D. in Mechanical Engineering Mathematics Physics or related fields
• 10 years of Finite Element Analysis (FEA) experience using ABAQUS or equivalent tools including experience with:
  • Advanced material properties (hyperelastic orthotropic phase change etc.)
  • Solver selection (explicit vs. implicit etc.)
  • MEMS (micro-electro-mechanical systems)
  • CTE (coefficient of thermal expansion) driven component deformation
• 5 years of meshing experience (HyperMesh or similar)
• 5 years of experience with programming/scripting languages (Python C etc.) to build custom analysis tools and procedures
• Ability to lead a cross-functional team with a simulation-first mindset
• Demonstrated experience using experimental and FEA best practices to validate simulation results and improve confidence in models
• Ability to work effectively on a globally distributed team
• Strong project management skills
• Strong analytical and problem-solving skills
• Demonstrated learning agility and strong teamwork
• Excellent oral and written English communication skills

Desired Skills:

• Knowledge of materials engineering and experience in material characterization for FEA
• Experience with advanced electronic packaging and sub-modeling
• Experience solving in frequency and time domains
• Experience with optimizing simulation setup for high performance computing clusters
• Knowledge of optimization tools and techniques including topology optimization
• Experience with data manipulation
• Leadership and mentoring experience

The pay range for this role is $116150.00 to $182400.00 USD annually with additional
opportunities for pay in the form of bonus and/or equity (applies to United
States of America candidates only). Pay varies by work location job-related
knowledge skills and experience.

Benefits:

HP offers a comprehensive benefits package for this position including:

* Health insurance
* Dental insurance
* Vision insurance
* Long term/short term disability insurance
* Employee assistance program
* Flexible spending account
* Life insurance
* Generous time off policies including;
* 4-12 weeks fully paid parental leave based on tenure
* 11 paid holidays
* Additional flexible paid vacation and sick leave (US benefits overview
compensation and benefits information is accurate as of the date of this
posting. The Company reserves the right to modify this information at any time
with or without notice subject to applicable law.

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Equal Opportunity Employer (EEO) -

HP Inc. provides equal employment opportunity to all employees and prospective employees without regard to race color religion sex national origin ancestry citizenship sexual orientation age disability or status as a protected veteran marital status familial status physical or mental disability medical condition pregnancy genetic predisposition or carrier status uniformed service status political affiliation or any other characteristic protected by applicable national federal state and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information review HPsEEO Policy or read about your rights as an applicant under the law here: Know Your Rights: Workplace Discrimination is Illegal