Sr. Package Design Engineer

San Jose, CA - USA

Monthly Salary: Not Disclosed

Posted on: Yesterday

Vacancies: 1 Vacancy

Job Summary

Note:

Primary Skills: asic package designs package designSI/PI routingsubstarate design HFSS Modeling and Simulation Semiconductor Packaging
Only USC or GC
NO JOB HOPPERS PLEASE AND STRONG CANDIDATES

We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development client. Youll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing.

Key Responsibilities:

Perform package substrate design and analysis (SI/PI/routing)
Collaborate with layout engineers marketing and global design teams
Use tools like HFSS ADS for package modeling/simulation
Contribute during pre/post-sales processes

Qualifications

BS in EE or related field; MS preferred
8 10 years of experience in semiconductor package design
Strong SI/PI analysis modeling and simulation skills
Excellent communication teamwork and presentation abilities

Preferred Skills:

Expertise in high-speed package/PCB design (SerDes PCIe LPDDR Ethernet)
Time/frequency domain analysis impedance jitter eye-diagram BER analysis
Experience with Hspice Redhawk electro-thermal simulation PDN modeling
Familiarity with reliability analysis and packaging/assembly rules

Why is This a Great Opportunity

outstanding technology great opportuity to learn. Growing company with a lot of IP. Everyone contributes.

Note: Primary Skills: asic package designs package designSI/PI routingsubstarate design HFSS Modeling and Simulation Semiconductor Packaging Only USC or GC NO JOB HOPPERS PLEASE AND STRONG CANDIDATES We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development c...