Sr. Layout Engineer HBM
Richardson, TX - USA
Job Summary
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.
As a Senior Layout Engineer at Micron Technology you will play a critical role in the physical implementation of advanced HighBandwidth Memory (HBM) designs. You will be responsible for blocklevel and toplevel layout development across modern technology nodes enabling 2.5D and 3D integration solutions. This role partners closely with design packaging signalintegrity and physical build teams to deliver robust manufacturable layouts that meet performance reliability and foundry requirements.
Responsibilities
Perform blocklevel and toplevel physical layout for HighBandwidth Memory (HBM) components across advanced process nodes
Implement layouts supporting 2.5D and 3D integration including TSVs microbump arrays keepout zones dietodie interfaces and alignment constraints
Apply and interpret HBMspecific design rules and foundry build requirements to ensure manufacturability and reliability
Run debug and close DRC LVS ERC density and signoff checks to achieve clean tapeout
Support parasitic extraction electromigration (EM) voltagedrop (IR) analysis and reliability verification; implement required layout updates
Collaborate with analog and mixedsignal designers to optimize floorplans and resolve layoutrelated performance tradeoffs
Partner with physical build packaging and signalintegrity teams on toplevel integration pin assignment and power distribution strategies
Ensure layout compliance with process constraints reliability guidelines and Micron internal standards
Minimum Qualifications
Bachelors degree or higher in Electrical Engineering Computer Engineering or a related field
5 years of experience in IC physical layout for advanced semiconductor technologies
Handson experience with DRC/LVS/PEX signoff flows and foundry rule decks
Strong understanding of advanced-node layout constraints and reliability considerations
Ability to work effectively across multi-functional teams with minimal supervision
Preferred Qualifications
Experience supporting HBM 2.5D or 3DIC designs including TSVbased integration
Familiarity with electro-migration and IRdrop analysis in highperformance memory designs
Experience collaborating with packaging and signalintegrity teams on complex integrations
As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.
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Required Experience:
Senior IC
About Company
Explore Micron Technology, leading in semiconductors with a broad range of performance-enhancing memory and storage solutions