Principal Packaging Eng, Annapurna Labs
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Job Location:
Cupertino, CA - USA
Monthly Salary:
Not Disclosed
Posted on:
9 days ago
Vacancies:
1 Vacancy
Job Summary
Annapurna Labs (our organization within AWS Utility Computing) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time agoeven yesterday. Our custom chips accelerators and software stacks enable us to take on technical challenges that have never been seen before and deliver results that help our customers change the world.
We are seeking experienced Hardware Design Engineers to build the next generation of our cloud server infrastructure. Our success depends on our world-class server infrastructure; were handling massive scale and rapid integration of emergent technologies.
As a member of the Machine Learning Acceleration team youll be responsible for the design and optimization of hardware in our data centers. Youll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced intellectually challenging position and youll work with thought leaders in multiple technology areas. Youll have high standards for yourself and everyone you work with and youll be constantly looking for ways to improve your products performance quality and cost. Were changing an industry and we want individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities
As a Mechanical Engineer you design and build the systems that are the heart of the worlds largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design including thermal solutions and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015 Annapurna Labs was acquired by Amazon Web Services (AWS). Since then we have accelerated its innovation and developed a number of products that benefit cloud customers including AWS Nitro technology Inferentia custom Machine Learning chips and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton driving innovation for general purpose compute; Nitro driving networking and storage scale security and Hypervisor offload and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
* BS or MS degree in Mechanical/Thermal Engineering
* 10 years industry experience in Mechanical and Thermal design of Systems
* Experience in thermal and performance measurements and characterization on SoCs Servers and Systems
* 3 years of experience SoC Thermal modelling and IC package transient thermal response
* Experience with Chip package System Mechanical & Thermal design for air-cooled and liquid-cooled systems
* Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
* Work with ODMs heatsink vendors and internal design teams on cross-boundary triaging debugging and resolving issues across organization.
* Knowledge of SoC thermal/mechanical design methodology power modeling and thermal analysis techniques
* Tool Familiarity: Ansys Icepak FloTherm Cadence Celsius PTC Creo and Solidworks
* Programming experience: Bash script Shell script Linux Python and Lua. Familiarity with working in Linux environment is an added advantage
* Working knowledge on fans valves chillers and CDUs
* Knowledge of various types of technologies used for Heatsink solutions Thermal Interface Materials (TIMs) and liquid cooling technologies
* Develop detailed CFD and compact RC models for SoC and Package thermal analysis
* Knowledge of hardware and software based thermal / power management control algorithms
* Optimize thermal solutions under PPA and system design constraints
* Simulate and prototype thermal control strategies
* Validate thermal models through power/thermal measurements on Hardware
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees supervisors and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees supervisors and staff to ensure exceptional customer service; and follow all federal state and local laws and Company policies. Criminal history may have a direct adverse and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above as well as the abilities to adhere to company policies exercise sound judgment effectively manage stress and work safely and respectfully with others exhibit trustworthiness and professionalism and safeguard business operations and the Companys reputation. Pursuant to the Los Angeles County Fair Chance Ordinance we will consider for employment qualified applicants with arrest and conviction records.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
We are seeking experienced Hardware Design Engineers to build the next generation of our cloud server infrastructure. Our success depends on our world-class server infrastructure; were handling massive scale and rapid integration of emergent technologies.
As a member of the Machine Learning Acceleration team youll be responsible for the design and optimization of hardware in our data centers. Youll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced intellectually challenging position and youll work with thought leaders in multiple technology areas. Youll have high standards for yourself and everyone you work with and youll be constantly looking for ways to improve your products performance quality and cost. Were changing an industry and we want individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities
As a Mechanical Engineer you design and build the systems that are the heart of the worlds largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design including thermal solutions and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015 Annapurna Labs was acquired by Amazon Web Services (AWS). Since then we have accelerated its innovation and developed a number of products that benefit cloud customers including AWS Nitro technology Inferentia custom Machine Learning chips and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton driving innovation for general purpose compute; Nitro driving networking and storage scale security and Hypervisor offload and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
* BS or MS degree in Mechanical/Thermal Engineering
* 10 years industry experience in Mechanical and Thermal design of Systems
* Experience in thermal and performance measurements and characterization on SoCs Servers and Systems
* 3 years of experience SoC Thermal modelling and IC package transient thermal response
* Experience with Chip package System Mechanical & Thermal design for air-cooled and liquid-cooled systems
* Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
* Work with ODMs heatsink vendors and internal design teams on cross-boundary triaging debugging and resolving issues across organization.
* Knowledge of SoC thermal/mechanical design methodology power modeling and thermal analysis techniques
* Tool Familiarity: Ansys Icepak FloTherm Cadence Celsius PTC Creo and Solidworks
* Programming experience: Bash script Shell script Linux Python and Lua. Familiarity with working in Linux environment is an added advantage
* Working knowledge on fans valves chillers and CDUs
* Knowledge of various types of technologies used for Heatsink solutions Thermal Interface Materials (TIMs) and liquid cooling technologies
* Develop detailed CFD and compact RC models for SoC and Package thermal analysis
* Knowledge of hardware and software based thermal / power management control algorithms
* Optimize thermal solutions under PPA and system design constraints
* Simulate and prototype thermal control strategies
* Validate thermal models through power/thermal measurements on Hardware
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees supervisors and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees supervisors and staff to ensure exceptional customer service; and follow all federal state and local laws and Company policies. Criminal history may have a direct adverse and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above as well as the abilities to adhere to company policies exercise sound judgment effectively manage stress and work safely and respectfully with others exhibit trustworthiness and professionalism and safeguard business operations and the Companys reputation. Pursuant to the Los Angeles County Fair Chance Ordinance we will consider for employment qualified applicants with arrest and conviction records.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience qualifications and location. Amazon also offers comprehensive benefits including health insurance (medical dental vision prescription Basic Life & AD&D insurance and option for Supplemental life plans EAP Mental Health Support Medical Advice Line Flexible Spending Accounts Adoption and Surrogacy Reimbursement coverage) 401(k) matching paid time off and parental leave. Learn more about our benefits at CA Cupertino - 217800.00 - 294700.00 USD annually
USA TX Austin - 189400.00 - 256200.00 USD annually
Required Experience:
Staff IC
About Company
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