Dry Etch DMTS, PD, Advance NAND

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a DMTS (Distinguished Member of Technical Staff) you will participate in a groundbreaking Next Generation NAND research and development Dry Etch team moving Advanced NAND and dry etch technology forward. The position provides ample chances for innovation cooperation and exploring new scaling methods with Next Generation NAND. A DMTS Dry Etch Engineer is a senior individual contributor and top industry expert who defines develops and transfers advanced dry etch processes for Micron NAND technologies. You will work directly with process integration and other areas including Wet Etch CVD Diffusion Metals Lithography and CMP. You will operate innovative dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include but are not limited to:

Leading advancements in Dry Etch technology and essential module development

• Act as a technical expert for dry etch process hardware and applications in NAND technology development at F10 Singapore.
• Your position encourages delivering broad technical vision deep domain expertise and perspective advised by extensive knowledge of dry etch physics/chemistry.
• Define the equipment roadmap. Work together with suppliers and develop a mechanism-focused logical hardware roadmap essential for the upcoming generation NAND dry etch.
• Able to benchmark Micron NAND dry etch capability against outstanding industry standards and translate external findings into internal advantage.
• Provides forward-looking technical insight on dry etch trends tool capabilities and integration risks.
• In addition to Micron-specific responsibilities the individual is encouraged to bring broad perspective and external insight from prior experience across highly reputed semiconductor companies.
• Provide technical mentorship and direction to SMTS/STS engineers; raise overall dry etch technical capability within the Singapore NAND organization.
• Resolve the most complex NAND yield defectivity and integration challenges through deep expertise in plasma physics surface interactions and materials.
• Represent Micron Singapore NAND dry etch interests at international conferences cross-site and cross-company technical forums.
• Contribute towards Technical Leadership Program.
• Mentor less experienced engineers and encourage skills within the team.

Individual contributor role

• Collaborate and lead multi-functional teams to solve sophisticated structural problems.
• Simplify problems through model-based problem solving.
• Champion AI based solutions through the TD ecosystem.
• Lead collaborative efforts across Technology Development Process Integration and Manufacturing.
• Develop and innovate dry etch methods to satisfy structural and electrical requirements.
• Lead innovative (FOAK) dry etch process development including recipe architecture EPD strategy control plans and integration alignment.
• Solid presentation skills in executive meetings. Present process and technology roadmaps for current and future technology nodes.
• Demonstrate predictive capability of a future issue and proactively build mitigation plan.
• Comfortable influencing technology roadmaps in other process areas.

Interaction with Dry Etch peers

• Serve as a resource and guide for colleagues in dry etch technology and/or project management.
• Provide critical updates to upper management on project status and impacts.

Successful candidates for this position will have:

• Demonstrated interest in research and development environment.
• 15-20 years experience in dry etch process development within R&D (NAND DRAM or Logic) moving into manufacturing roles with 10-15 years specifically in memory products such as NAND and DRAM.
• Knowledge of plasma physics plasma chemistry transport or surface phenomena gained through experience and/or coursework.
• Demonstrated leadership in problem solving. Experience in managing technical projects.
• Understanding various types of plasma dry etch reactors (e.g. RF sources chemistries).
• Expertise in statistical process control and analysis.
• Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes.
• Lead supplier head to heads.
• Strong computer skills including MS Office and SAS software like JmP and similar.
• Data science basics / Python coding / AI coders could be preferred over candidates without this experience.

Education

• PhD (Chemical Mechanical Electrical Material Science Physics Chemical physics Chemistry Semiconductor engineering or related fields) with 15-20 years of applicable dry etch process development background
• BS/MS (Chemical Mechanical Electrical Material Science Physics Chemical physics Chemistry Semiconductor engineering or related fields) with over 18 years of pertinent experience

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

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