Senior Engineer, NTI Metrology

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As Senior Metrology Development Engineer in the Singapore TD department at Micron Technology Inc. you will be responsible for rapid deployment of innovative 3D NAND process technologies drive development efforts prior to device ramp define & execute effective actions to enable solutions required to hit key breakthroughs & achieve the required performance within timelines. This role requires hands-on experience with X raybased metrology techniques within the semiconductor industry particularly for advanced 3D NAND applications.

Job Responsibilities

• Process development tasks such as developing Scattered-Electron-Microscope (SEM) metrology models driving the understanding of new metrology technology and measurement techniques in 3D NAND technology including Xraybased metrology (e.g. XRF XRR XRD SAXS Xray CD or Xray tomography).
• Own applications and develop processes of new nodes demonstrating Xray metrology techniques to enable robust process control.
• Identify and provide solutions for inline detection in collaboration with process engineer and process integration with emphasis on nondestructive Xray methods for buried or highaspectratio structures.
• Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe integrating Xray and SEM data where applicable.
• Collaborate with HVM Metro team on technology choices for the upcoming nodes and able to translate future technology device needs into clear equipment roadmap requirements including Xray metrology capability gaps and scaling requirements.
• Work closely with the planning team to understand Model-on-record (MOR) impact of new technology. Maintain MOR accuracy to enable successful technology ramp.
• Influence supplier equipment roadmap to enable new technology development in Micron specifically driving nextgeneration Xray metrology solutions for advanced 3D NAND structures.

Requirements:

• Bachelors or Masters degree in Material Science Physics or a related field.
• Familiarity with X-ray based metrology techniques materials characterization and data analysis with demonstrated experience in metrology within a semiconductor manufacturing or development environment.
• Basic knowledge of operating troubleshooting and handson experience with Xray metrology tools (e.g. XRF XRR XRD SAXS Xray CD or Xray imaging systems).
• Strong collaboration and communication skills with the ability to work in multidisciplinary teams.
• Analytical and problem-solving skills with a focus on continuous improvement.
• Display Micron Value of People. Innovation Tenacity Collaboration and Customer Focus

Preferred Skills:

• Experience with semiconductor device fabrication and characterization.
• Direct experience applying Xray metrology to advanced nodes (e.g. highaspectratio features buried layers or complex 3D NAND stacks)
• Knowledge of statistical analysis and data interpretation.
• Familiarity with data science and machine learning is a plus.

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

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