Process Engineer Backside Processing & Plating Technologies (mfd) 100
Share
Job Location:
Zürich - Switzerland
Monthly Salary:
Not Disclosed
Posted on:
Yesterday
Vacancies:
1 Vacancy
Job Summary
Coherent Corp. is the global leader in photonics designing and manufacturing advanced laser optical and material technologies used by customers worldwide across industrial communications electronics and instrumentation markets.
With a broad global footprint and deep engineering capability we combine advanced manufacturing applied innovation and customer collaboration to deliver high-performance solutions that enable critical technologies and solve complex real-world challenges.
About Coherent in Switzerland
Coherent Corp. Zurich is a key research and production hub specializing in advanced photonics engineered materials and high-power semiconductor laser technologies. Our teams develop and manufacture opto-electronic components and laser diodes for industrial optical data transmission life science and high-precision applications combining strong in-house R&D with state-of-the-art semiconductor manufacturing in an engineering-led culture.
Location:Zurich Switzerland (Onsite) Employment Type:Permanent full-time
Job Summary
For our Process Engineering department we are looking for an Engineer to support and further develop wafer backside processing and plating technologies processes in our GaAs/InP production line. The role includes responsibility for the evaluation of advanced plating/deplating technologies and the introduction of a temporary bonding process equipment addition the position supports the development of thin wafer handling technologies including wafer thinning and sawing.
Key Responsibilities
- Optimize and support the introduction of temporary bonding and debonding processes including adhesive coating and in line metrology with new equipment in a team of engineers.
- Develop plating and metal structuring processes including bump plating electrochemical deposition and metal removal techniques such as deplating and wet etching.
- Support the evaluation of wafer thinning and planarization manufacturing equipment.
- Maintain and continuously improve assigned wafer processing and singulation processes. Diagnose and resolve issues in the manufacturing process.
- Conduct test series and DOE studies analyze results and prepare technical reports.
- Support yield improvement activities in wafer thinning singulation and VCSEL processing.
- Regularly review and update process documentation specifications and work instructions and train production personnel.
- Interface with external equipment manufacturers and act as the internal technical expert for assigned processes.
- Collaborate closely with engineering R&D and production teams to introduce new wafer processing technologies.
Qualifications
- . Chemistry Physics Materials Science Optics Mechanical Engineering Electrical Engineering or a related field with 35 years of relevant industry experience.
- Or a PhD in a relevant field which may be considered in lieu of professional experience or with reduced experience requirements.
Skills & Other Requirements
- Solid background in semiconductor process engineering or a closely related industry.
- Knowledge of singulation/thinning technologies or temporary wafer bonding/debonding as well as coating is a plus.
- Experience in planning scheduling and executing engineering projects.
- Competent in design of experiments (DOE) and statistical process control. Certifications such as Six Sigma are advantageous.
- Proficiency in root cause analysis techniques such as 5 Whys Fishbone Diagrams and FMEA.
- Strong communication skills and ability to work effectively with cross-functional teams including design quality and production.
- Experience with programming (C# Python) and statistical tools (JMP Minitab) is an asset.
- Excellent written and spoken proficiency in German and English.
Application Process
All candidates who wish to apply should submit a CV and cover letter outlining their interest in the position and how their skills and experience align with the requirements of the role.
Applications for this role close end of day on Thursday 30 April 2026.
If you require any adjustments or accommodations during the application process please reach out to . We are committed to creating an inclusive and accessible recruitment experience and encourage applications from individuals of all backgrounds.
Required Experience:
IC
Key Skills
About Company
Coherent is a global leader in lasers, engineered materials and networking components. We are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor ... View more
