Packaging Engineer, Annapurna Labs
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Job Location:
Taipei City - Taiwan
Monthly Salary:
Not Disclosed
Posted on:
2 days ago
Vacancies:
1 Vacancy
Job Summary
Annapurna Labs is looking for a Packaging Engineer. As a member of the team you will join a group of hardworking engineers to design and implement innovative next generation machine learning chips and this position you will make a real impact in a dynamic technology focused team. Your work will impact the growing field of machine learning.
You will collaborate with architects design teams software engineers to deliver the next generation ML this position you will have the opportunity to be responsible for IP integration 2.5D design bring up Characterization and validation.
Key job responsibilities
* Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap
* Engage with product architect and design teams on future products package and assembly needs
* Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products
* Engage with substrate and assembly vendors on future technologies roadmap
Product development and manufacturing:
* Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs
* Assume full ownership of mechanical and thermal performance of Annapurna ICs
* In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
* Ensure testability of the ICs in collaboration with Test Engineer team
* Work with Assembly Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces)
* Track assembly and substrate yields and look for ways to improve them
- . or . degree in Electrical Engineering Applied Physics or related fields
- 5 years of professional experience in similar role
- High communication skills
- Dive deep quickly into unfamiliar domains
- Strong analytic and problem-solving skills
- Ability to work independently on multiple issues
- Good understanding of transmission line theory power delivery and signal integrity is desired.
- Strong programming and scripting skills in Perl Python Tcl desired Cadence Skill and EXCEL familiarity are helpful.
- Enthusiastic and able to work with a minimum of supervision.
- Can solve complex technical problems
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
You will collaborate with architects design teams software engineers to deliver the next generation ML this position you will have the opportunity to be responsible for IP integration 2.5D design bring up Characterization and validation.
Key job responsibilities
* Evaluation of packaging and assembly technology roadmap aligned to Annapurna product roadmap
* Engage with product architect and design teams on future products package and assembly needs
* Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products
* Engage with substrate and assembly vendors on future technologies roadmap
Product development and manufacturing:
* Define the substrate and package BOM of the ICs in collaboration with Package Design team and OSATs
* Assume full ownership of mechanical and thermal performance of Annapurna ICs
* In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
* Ensure testability of the ICs in collaboration with Test Engineer team
* Work with Assembly Test and Logistics to define work flows at OSATs (focus on Fab/assembly/test interfaces)
* Track assembly and substrate yields and look for ways to improve them
- . or . degree in Electrical Engineering Applied Physics or related fields
- 5 years of professional experience in similar role
- High communication skills
- Dive deep quickly into unfamiliar domains
- Strong analytic and problem-solving skills
- Ability to work independently on multiple issues
- Good understanding of transmission line theory power delivery and signal integrity is desired.
- Strong programming and scripting skills in Perl Python Tcl desired Cadence Skill and EXCEL familiarity are helpful.
- Enthusiastic and able to work with a minimum of supervision.
- Can solve complex technical problems
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
Required Experience:
IC
Key Skills
About Company
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