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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.
The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups suppliers and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast learn continuously and work as one team! This position is intended to be part of Microns Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence lead and mentor others.
Position Overview:
We are seeking an experienced organizational leader who will lead and influence methodology improvements including best practices in process development data-driven decision-making and application of AI/advanced analytics to drive this role you will drive strategic process development for Microns most advanced memory products including HBM 3DS DRAM and emerging 3D architectures. You will guide endtoend technology execution partner across organizations and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation complexity and collaboration.
Responsibilities:
Own advanced packaging process technologies across waferlevel and dielevel modules from pathfinding through manufacturing readiness
Develop and mature novel process flows materials and integration schemes that meet electrical mechanical thermal cost and reliability needs
Lead FOAK development supplier engagement and ecosystem collaboration to close capability gaps and accelerate learning
Drive structured problem solving for multidomain technical challenges and guide strategic decisions across programs
Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams
Minimum Qualifications:
MS in Chemistry Chemical Engineering Materials Science or related field (or equivalent experience)
15 years in semiconductor process development manufacturing or advanced packaging
Deep expertise in waferlevel or dielevel processes such as CMP etch cleans thin films lithography hybrid bonding TCB dicing or molding
Strong understanding of semiconductor process integration and materials interactions
Proven experience leading complex crossfunctional technical programs
Preferred Qualifications:
PhD in a relevant technical field
Extensive experience with advanced memory technologies or 3D packaging architectures
Experience mentoring other engineers and driving technical methodology improvements
Familiarity with materials characterization and simulation (thermal mechanical electrical)
As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.
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Required Experience:
IC
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